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AUTOMATIC MANUFACTURING PROCESS FOR PROVIDING BUFFER PADS FOR A PCB AND PCB STRUCTURE USING THE SAME

  • US 20140251668A1
  • Filed: 08/19/2013
  • Published: 09/11/2014
  • Est. Priority Date: 03/07/2013
  • Status: Abandoned Application
First Claim
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1. An automatic manufacturing process for providing buffer pads for a print circuit board, comprising:

  • a) providing the print circuit board;

    b) providing an automatic dispensing device and an adhesive;

    c) using the automatic dispensing device to dispense the adhesive to a buffer zone on the print circuit board;

    d) providing a pick-and-place machine and the buffer pads;

    e) using the pick-and-place machine to place the buffer pads on the buffer zone moistened with the adhesive; and

    f) curing the adhesive to attach the buffer pads to the print circuit board.

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