AUTOMATIC MANUFACTURING PROCESS FOR PROVIDING BUFFER PADS FOR A PCB AND PCB STRUCTURE USING THE SAME

• US 20140251668A1
• Filed: 08/19/2013
• Published: 09/11/2014
• Est. Priority Date: 03/07/2013
• Status: Abandoned Application

• Current Assignee: Delta Electronics Company Limited (Delta Electronics Incorporated)
• Original Assignee: Delta Electronics Incorporated
• Inventors: CHUANG, Chun-Kai, LEE, Yu-Wei, LEE, Kuo-Liang
• Application Number:
  US13/969,940
• Publication Number:
  US 20140251668A1
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An automatic manufacturing process for providing buffer pads (40) for a PCB (10), includes a) providing the PCB (10); b) providing an automatic dispensing device and an adhesive (30); c) using the automatic dispensing device to dispense the adhesive (30) to a buffer zone (12) on the PCB (10); d) providing a pick-and-place machine and the buffer pads (40); e) using the pick-and-place machine to place the buffer pads (40) on the buffer zone (12) moistened with the adhesive (30); and f) curing the adhesive (30) to attach the buffer pads (40) to the PCB (10). Thus, labor is saved and manufacturing time is reduced.

Claims

1. An automatic manufacturing process for providing buffer pads for a print circuit board, comprising:

a) providing the print circuit board;

b) providing an automatic dispensing device and an adhesive;

c) using the automatic dispensing device to dispense the adhesive to a buffer zone on the print circuit board;

d) providing a pick-and-place machine and the buffer pads;

e) using the pick-and-place machine to place the buffer pads on the buffer zone moistened with the adhesive; and

f) curing the adhesive to attach the buffer pads to the print circuit board.

2. The automatic manufacturing process according to claim 1, wherein step a) further comprises providing a solder paste printing device and solder paste, and using the solder paste printing device to print the solder paste on the print circuit board.

3. The automatic manufacturing process according to claim 2, wherein step a) further comprises providing a metal stencil through which the solder paste printing device prints the solder paste on the print circuit board.

4. The automatic manufacturing process according to claim 1, wherein the pick-and-place machine in step d) moves the buffer pads by vacuum suction.

5. The automatic manufacturing process according to claim 1, wherein step d) further comprises providing at least one SMT electronic component, wherein the pick-and-place machine places the SMT electronic component on the print circuit board simultaneously in step e).

6. The automatic manufacturing process according to claim 1, wherein the pick-and-place machine in step d) moves the SMT electronic component by vacuum suction.

7. The automatic manufacturing process according to claim 1, wherein the buffer pads in step d) are made of a high-temperature resistant and anti-shock material.

8. The automatic manufacturing process according to claim 1, wherein step f) further comprises providing a reflow oven into which the print circuit board is sent to cure the adhesive.

9. A printed circuit board device, comprising:

a print circuit board comprising at least one electrical connection zone and at least one buffer zone;

at least one SMT electronic component attached on the electric connection zone;

an adhesive disposed on the buffer zone; and

a buffer pad made of a high-temperature resistant and anti-shock material, the buffer pad being sticked securely to the buffer zone via the adhesive.

10. The print circuit board device according to claim 9, wherein the adhesive is disposed on one side of the electrical connection zone.

11. The print circuit board device according to claim 9, further comprising a solder paste disposed at two ends of the electrical connection zone.

12. The print circuit board device according to claim 9, wherein the adhesive is a thermoplastic adhesive.

13. The print circuit board device according to claim 9, wherein the buffer pad is disposed on one side of the SMT electronic component.

14. The print circuit board device according to claim 9, wherein a thickness of the buffer pad is higher than that of the SMT electronic component.