IN-MOLDED RESISTIVE AND SHIELDING ELEMENTS

• US 20140251781A1
• Filed: 01/31/2014
• Published: 09/11/2014
• Est. Priority Date: 04/20/2007
• Status: Abandoned Application

• Current Assignee: T-Ink Inc. (Winnick & Co., Inc.)
• Original Assignee: T-Ink Inc. (Winnick & Co., Inc.)
• Inventors: Haag, Ronald H., Engel, Jeffrey R., Boddie, William W. Jr.
• Application Number:
  US14/169,818
• Publication Number:
  US 20140251781A1
• Time in Patent Office: Days
• US Class Current: 200/600
• CPC Class Codes: B29C 2045/14237 the inserts being deformed or preformed outside the mould or mould cavity
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29K 2995/0011 Electromagnetic wave shielding material
• CPC Class Codes: B29L 2031/466 Keypads, keytops
• CPC Class Codes: H01H 11/04 of switch contacts
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H03K 17/9622 using a plurality of detectors, e.g. keyboard
• CPC Class Codes: H03K 2217/96019 using conductive paint
• CPC Class Codes: H03K 2217/960755 Constructional details of capacitive touch and proximity switches
• CPC Class Codes: H03K 2217/960785 with illumination
• CPC Class Codes: H03K 2217/96079 using a single or more light guides
• CPC Class Codes: H05K 9/0092 comprising electro-conductive pigments, e.g. paint, ink, tampon printing
• CPC Class Codes: Y10T 29/49082 Resistor making

Abstract

An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Claims

1-15. -15. (canceled)

16. An article of manufacture comprising:

a formable plastic film having a surface;

at least one printed graphical layer on the surface of the formable plastic film;

at least one first printed conductive ink layer on the surface of the formable plastic film or on the graphical layer;

at least one non-conductive layer printed on the first printed conductive ink layer;

at least one second printed conductive ink layer printed on the non-conductive layer, wherein the at least one non-conductive layer insulates the at least one first conducive ink layer from the at least one second conductive ink layer; and

a plastic support structure,

wherein the surface of the formable plastic film faces the plastic support structure and wherein the formable plastic film is secured to the plastic support structure to form a substantially rigid structure.

17. The article of claim 16, wherein at least one non-conductive layer is a dielectric layer.

18. The article of claim 16, further comprising at least one ground layer.

19. The article of claim 16, wherein the at least one second printed conductive ink layer comprises a conductive ink layer sensing zone.

20. The article of claim 16, wherein the at least one non-conducive ink layer substantially covers the at least one first conductive layer.

21. The article of claim 16, wherein the plastic support structure is a molded plastic support structure.

22. The article of claim 16, wherein the at least one first conductive ink layer is not exposed.

23. The article of claim 16, wherein the at least one second conductive ink layer is not exposed.

24. The article of claim 16, further comprising at least one connector electrically connected to the at least one first printed conductive ink layer or the at least one second printed conductive ink layer, wherein a portion of the at least one connector projects away from the plastic support structure.

25. A control device, comprising:

the article of claim 19, wherein the at least one conductive ink sensing zone is electrically connected to a circuit that is operable to detect capacitance changes.