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SYSTEMS AND METHODS FOR POWER TRAIN ASSEMBLIES

  • US 20140252541A1
  • Filed: 03/11/2013
  • Published: 09/11/2014
  • Est. Priority Date: 03/11/2013
  • Status: Abandoned Application
First Claim
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1. A power train assembly comprising:

  • a component package comprising;

    a first transistor comprising a first gate, a first drain, and a first source;

    a second transistor comprising a second gate, a second drain, and a second source; and

    a thermal pad configured to dissipate heat generated in said component package, wherein said thermal pad is electrically coupled to said first source and said second drain;

    a printed circuit board (PCB) electrically coupled to said component package; and

    an electrical component electrically coupled directly to a top surface of said thermal pad in a first plane and to said PCB in a second plane that is parallel to said first plane, wherein the electrical component is external to the component package.

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