SYSTEMS AND METHODS FOR POWER TRAIN ASSEMBLIES

• US 20140252541A1
• Filed: 03/11/2013
• Published: 09/11/2014
• Est. Priority Date: 03/11/2013
• Status: Abandoned Application

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Nanov, Ivan Dimitrov, Steel, John Frank
• Application Number:
  US13/792,293
• Publication Number:
  US 20140252541A1
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49555 the bent parts being the outer leads
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/1053 Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A power train assembly is provided. The power train assembly includes a component package including a first transistor having a first gate, a first drain, and a first source, a second transistor having a second gate, a second drain, and a second source, and a thermal pad configured to dissipate heat generated in the component package, wherein the thermal pad is electrically coupled to the first source and the second drain. The power train assembly further includes a printed circuit board (PCB) electrically coupled to the component package, and an electrical component electrically coupled directly to the thermal pad, wherein the electrical component is external to the component package.

Claims

1. A power train assembly comprising:

a component package comprising;

a first transistor comprising a first gate, a first drain, and a first source;

a second transistor comprising a second gate, a second drain, and a second source; and

a thermal pad configured to dissipate heat generated in said component package, wherein said thermal pad is electrically coupled to said first source and said second drain;

a printed circuit board (PCB) electrically coupled to said component package; and

an electrical component electrically coupled directly to a top surface of said thermal pad in a first plane and to said PCB in a second plane that is parallel to said first plane, wherein the electrical component is external to the component package.

2. A power train assembly in accordance with claim 1, wherein said electrical component comprises an inductor.

3. A power train assembly in accordance with claim 1, wherein said electrical component comprises a transformer winding.

4. A power train assembly in accordance with claim 1, further comprising:

a first lead electrically coupling a first terminal of said electrical component directly to said thermal pad in said first plane; and

a second lead electrically coupling a second terminal of said electrical component to a connection point of said PCB in said second plane.

5. A power train assembly in accordance with claim 4, wherein at least one of said first lead and said second lead is bent under said electrical component.

6. A power train assembly in accordance with claim 1, wherein at least a portion of said electrical component overlaps said component package to conserve board space on said PCB.

7. A power train assembly in accordance with claim 1, further comprising an additional component package electrically coupled to said electrical component through said PCB, wherein said component package, said electrical component, and said additional component package form a full bridge converter.

8. A power train assembly in accordance with claim 1, wherein said thermal pad is a copper clip.

9. A component package comprising:

a first transistor comprising a first gate, a first drain, and a first source;

a second transistor comprising a second gate, a second drain, and a second source; and

a thermal pad configured to dissipate heat generated in said component package, wherein said thermal pad is electrically coupled to said first source and said second drain and directly coupled, at a top surface of said pad, to at least one additional electrical component.

10. A component package in accordance with claim 9, wherein said first and second transistors each comprise a metal-oxide-semiconductor field-effect transistor.

11. A component package in accordance with claim 9, wherein said thermal pad is a copper clip.

12. A component package in accordance with claim 9, further comprising a driver circuit electrically coupled to said first gate and said second gate, said driver circuit configured to switch said first and second transistors on and off at a high frequency.

13. A component package in accordance with claim 9, further comprising a heat sink coupled to said thermal pad.

14. A component package in accordance with claim 9, wherein said component package forms at least a portion of a buck synchronous switching regulator.

15. A method of assembling a power train assembly, said method comprising:

electrically coupling a component package to a printed circuit board (PCB), the component package including a first transistor including a first gate, a first drain, and a first source, a second transistor including a second gate, a second drain, and a second source, and a thermal tab electrically coupled to the first source and the second drain; and

electrically coupling an electrical component directly to a top surface of the thermal pad in a first plane and to the PCB in a second plane that is parallel the first plane, the electrical component external to the component package.

16. A method in accordance with claim 15, further comprising:

electrically coupling the electrical component between the thermal tab and the PCB.

17. A method in accordance with claim 15, wherein electrically coupling an electrical component comprises electrically coupling at least one of an inductor and a transformer winding directly to the thermal tab.

18. A method in accordance with claim 15, further comprising:

providing a second component package including a second thermal tab; and

electrically coupling the electrical component between the thermal tab and the second thermal tab.

19. A method in accordance with claim 15, further comprising:

electrically coupling the electrical component between the thermal tab and a second PCB.

20. A method in accordance with claim 15, wherein electrically coupling a component package comprises electrically coupling a semiconductor package.