SYSTEMS AND METHODS FOR POWER TRAIN ASSEMBLIES
First Claim
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1. A power train assembly comprising:
- a component package comprising;
a first transistor comprising a first gate, a first drain, and a first source;
a second transistor comprising a second gate, a second drain, and a second source; and
a thermal pad configured to dissipate heat generated in said component package, wherein said thermal pad is electrically coupled to said first source and said second drain;
a printed circuit board (PCB) electrically coupled to said component package; and
an electrical component electrically coupled directly to a top surface of said thermal pad in a first plane and to said PCB in a second plane that is parallel to said first plane, wherein the electrical component is external to the component package.
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Abstract
A power train assembly is provided. The power train assembly includes a component package including a first transistor having a first gate, a first drain, and a first source, a second transistor having a second gate, a second drain, and a second source, and a thermal pad configured to dissipate heat generated in the component package, wherein the thermal pad is electrically coupled to the first source and the second drain. The power train assembly further includes a printed circuit board (PCB) electrically coupled to the component package, and an electrical component electrically coupled directly to the thermal pad, wherein the electrical component is external to the component package.
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Citations
20 Claims
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1. A power train assembly comprising:
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a component package comprising; a first transistor comprising a first gate, a first drain, and a first source; a second transistor comprising a second gate, a second drain, and a second source; and a thermal pad configured to dissipate heat generated in said component package, wherein said thermal pad is electrically coupled to said first source and said second drain; a printed circuit board (PCB) electrically coupled to said component package; and an electrical component electrically coupled directly to a top surface of said thermal pad in a first plane and to said PCB in a second plane that is parallel to said first plane, wherein the electrical component is external to the component package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A component package comprising:
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a first transistor comprising a first gate, a first drain, and a first source; a second transistor comprising a second gate, a second drain, and a second source; and a thermal pad configured to dissipate heat generated in said component package, wherein said thermal pad is electrically coupled to said first source and said second drain and directly coupled, at a top surface of said pad, to at least one additional electrical component. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method of assembling a power train assembly, said method comprising:
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electrically coupling a component package to a printed circuit board (PCB), the component package including a first transistor including a first gate, a first drain, and a first source, a second transistor including a second gate, a second drain, and a second source, and a thermal tab electrically coupled to the first source and the second drain; and electrically coupling an electrical component directly to a top surface of the thermal pad in a first plane and to the PCB in a second plane that is parallel the first plane, the electrical component external to the component package. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification