GRADED-GROUND DESIGN IN A MILLIMETER-WAVE RADIO MODULE

• US 20140253382A1
• Filed: 05/23/2014
• Published: 09/11/2014
• Est. Priority Date: 05/07/2012
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Wilocity, Ltd. (Qualcomm, Inc.)
• Inventors: Yehezkely, Alon, Markish, Ofer
• Granted Patent: US 9,680,232 B2
• Time in Patent Office: Days
• US Class Current: 342/385
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/0093 Monolithic arrays
• CPC Class Codes: H01Q 21/067 using endfire radiating aerial units transverse to the plane of the array
• CPC Class Codes: H01Q 21/205 providing an omnidirectional coverage turnstile aerials H01Q21/26
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

A millimeter-wave radio frequency (RF) module is provided. The RF module includes a multilayer substrate having at least a front layer, a back layer, a plurality of middle layers, a first ground layer, and a second ground layer, wherein the first ground layer includes a graded-ground plane having a pair of non-overlapping ground lines connected at a single connection point through a graded connection, and wherein the second ground layer includes a double graded-ground plane having a pair of overlapping ground lines connected at a single connection point through a graded connection, wherein the first ground layer and the second ground layer provide a reference ground to a transmission line included in the multilayer substrate.

Claims

1. A millimeter-wave radio frequency (RF) module, comprising:

a multilayer substrate having at least a front layer, a back layer, a plurality of middle layers, a first ground layer, and a second ground layer,

wherein the first ground layer includes a graded-ground plane having a pair of non-overlapping ground lines connected at a single connection point through a graded connection, and wherein the second ground layer includes a double graded-ground plane having a pair of overlapping ground lines connected at a single connection point through a graded connection, wherein the first ground layer and the second ground layer provide a reference ground to a transmission line included in the multilayer substrate.

2. The RF module of claim 1, further comprises:

a first antenna sub-array implemented in the front layer;

a second antenna sub-array implemented in the back layer; and

a plurality of middle antenna sub-arrays implemented in the plurality of the middle layers,

wherein each of the first antenna sub-array, the second antenna sub-array, and the plurality of middle antenna sub-arrays is configured to radiate millimeter-wave signals at a different direction.

3. The RF module of claim 2, wherein the first ground layer is between the front layer and one of the middle layers, and wherein the second ground layer is between the back layer and one of the middle layers.

4. The RF module of claim 2, wherein the double graded-ground plane provides a reference ground to at least the second antenna sub-array.

5. The RF module of claim 2, wherein the graded-ground plane provides a reference ground to at least the first antenna sub-array and the plurality of middle antenna sub-arrays, wherein each of the first antenna sub-array and the plurality of middle antenna sub-arrays is affected by a different ground line of the non-overlapping pair of ground lines.

6. The RF module of claim 1, wherein a first ground line of the non-overlapping pair of ground lines is at a first distance from the front layer and a second ground line of the non-overlapping pair of ground lines is at a second distance from the front layer, wherein the first distance is shorter than the second distance.

7. The RF module of claim 6, wherein values for the first distance and the second distance are based on a center wavelength of a frequency band of the antenna sub-arrays.

8. The RF module of claim 6, wherein the frequency band is at least 60 GHz.

9. The RF module of claim 8, wherein a first ground line of the pair of the overlapping pair of ground lines overlaps a second ground line of the pair of overlapping pair ground lines for a first length, wherein the first length is shorter than a length of the second ground line.

10. The RF module of claim 9, wherein values of the first distance, the second distance, and the first length are selected to impedance match the transmission line.

11. The RF module of claim 1, wherein the single connection points of the graded-ground plane and the double graded-ground plane are aligned with each other.

12. The RF module of claim 11, wherein each of the graded connections is through at least one via in the multilayer substrate.

13. The RF module of claim 2, further comprises RF circuitry configured to independently control the first antenna sub-array, the second antenna sub-array, and each of the plurality of middle antenna sub-arrays.

14. The RF module of claim 13, further comprises discrete electronic components providing a chip-board transition structure, wherein the RF circuitry and the discrete electronic components are mounted on the front layer of the multi-layer substrate.

15. The RF module of claim 1, wherein the first ground layer and the second ground layer are common.

16. The RF module of claim of 15, wherein each of the front layer, the back layer, and the middle layers is a combination of metal and dielectric layers.

17. The RF module of claim 16, wherein the front layer, the back layer, and the middle layers can be made of a material including at least one of:

a laminate material, a ceramic material, a polymer material, a PTFE (Polytetrafluoroethylene) based composition, and a Woven glass reinforced material.