CHIP-ON-GLASS FOR TOUCH APPLICATIONS
First Claim
1. A method for fabricating a touch panel assembly, the method comprising:
- providing a touch panel including a substrate having a plurality of electrical connectors formed on the substrate;
applying a conductive adhesive to the substrate; and
disposing an integrated circuit upon the conductive adhesive and the substrate to form the touch panel assembly,wherein the electrical connectors are conductors.
4 Assignments
0 Petitions
Accused Products
Abstract
A touch panel assembly device implementing chip-on-glass technology and a method (e.g., process) for making same are described herein. The touch panel assembly includes a touch panel (e.g., a capacitive touch panel). The touch panel includes a substrate formed of insulator material (e.g., glass). The touch panel also includes a plurality of conductors (e.g., transparent conductors, indium tin oxide traces) formed on the substrate. The touch panel assembly further includes an integrated circuit (e.g., a touch chip). The integrated circuit is disposed upon the substrate and is connected (e.g.., mechanically and electrically connected) to one or more conductors included in the plurality of conductors. The integrated circuit is communicatively coupled with the touch panel.
23 Citations
20 Claims
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1. A method for fabricating a touch panel assembly, the method comprising:
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providing a touch panel including a substrate having a plurality of electrical connectors formed on the substrate; applying a conductive adhesive to the substrate; and disposing an integrated circuit upon the conductive adhesive and the substrate to form the touch panel assembly, wherein the electrical connectors are conductors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A touch panel assembly, comprising:
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a touch panel, the touch panel including a substrate formed of insulator material, the touch panel including a plurality of conductors formed on the substrate; and an integrated circuit, the integrated circuit being disposed upon the substrate and connected to one or more conductors included in the plurality of conductors, the integrated circuit configured for being communicatively coupled with the touch panel. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A touch panel assembly, comprising:
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a touch panel, the touch panel including a substrate, the touch panel including a plurality of transparent conductors formed on the substrate; an integrated circuit, the integrated circuit being disposed upon the substrate and bonded to one or more transparent conductors included in the plurality of transparent conductors via a conductive adhesive, the integrated circuit being communicatively coupled with the touch panel; a display screen, the display screen being connected to the touch panel; a printed circuit board, the printed circuit board being connected to the touch panel and the integrated circuit via a flexible printed circuit board; and a controller, the controller being communicatively coupled with the touch panel and the integrated circuit, the controller being configured for controlling the touch panel. - View Dependent Claims (17, 18, 19, 20)
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Specification