LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, PIEZOELECTRIC ELEMENT, AND METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT

• US 20140253641A1
• Filed: 02/20/2014
• Published: 09/11/2014
• Est. Priority Date: 03/05/2013
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: FURUYA, Noboru
• Granted Patent: US 9,174,441 B2
• Time in Patent Office: Days
• US Class Current: 347/71
• CPC Class Codes: B41J 2/14201 Structure of print heads with piezoelectric elements
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1607 Production of print heads with piezoelectric elements B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/161 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1625 electroforming
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: H10N 30/877 Conductive materials

Abstract

A flow channel substrate has pressure chambers, and the pressure chambers communicate with nozzle openings configured to eject liquid. Each of piezoelectric elements on the flow channel substrate has a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes. The wiring layer has a first layer on the flow channel substrate side and a second layer on the first layer. The first layer contains palladium and is formed by pretreatment, whereas the second layer contains nickel and is formed by electroless plating.

Claims

1. A liquid ejecting head comprising:

a flow channel substrate, the flow channel substrate having a pressure chamber communicating with a nozzle opening configured to eject liquid; and

a piezoelectric element, the piezoelectric element provided to the flow channel substrate and having a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes,

the wiring layer having

the first layer containing palladium and formed by pretreatment, and

a second layer on the first layer, the second layer containing nickel and formed by electroless plating.

2. The liquid ejecting head according to claim 1, wherein

the wiring layer further has:

a third layer on the second layer, the third layer containing palladium and formed by electroless plating, and

a fourth layer on the third layer, the fourth layer containing gold and formed by electroless plating.

3. The liquid ejecting head according to claim 1, wherein the pair of electrodes are a first electrode on a flow channel substrate side and a second electrode on a side of the piezoelectric layer opposite the flow channel substrate.

4. The liquid ejecting head according to claim 3, wherein:

the first electrode includes a plurality of separate electrodes for a plurality of active sections, i.e., practical actuating elements, the separate electrodes electrically isolated from each other; and

the second electrode serves as a common electrode for the active sections, the common electrode electrically continuous.

5. The liquid ejecting head according to claim 1, wherein the pretreatment for forming the first layer is dip coating.

6. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

7. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 2.

8. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 3.

9. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 4.

10. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 5.

11. A piezoelectric element comprising:

a piezoelectric layer;

a pair of electrodes; and

a wiring layer coupled to the electrodes,

the wiring layer having;

the first layer containing palladium and formed by pretreatment, and

a second layer on the first layer, the second layer containing nickel and formed by electroless plating.

12. A method for manufacturing a piezoelectric element having a piezoelectric layer, a pair of electrodes, and a wiring layer coupled to the electrodes, the method comprising:

forming a mask on the electrodes with the electrodes exposed, the mask perforated at least in a region where the wiring layer is to be formed;

forming a palladium-containing first layer by pretreatment;

removing the mask; and

forming a nickel-containing second layer on the first layer by electroless plating.

13. The method for manufacturing a piezoelectric element according to claim 12, the method further comprising:

forming a palladium-containing third layer on the second layer by electroless plating; and

forming a gold-containing fourth layer on the third layer by electroless plating.