THERMAL ISOLATION IN PRINTED CIRCUIT BOARD ASSEMBLIES

• US 20140254108A1
• Filed: 03/10/2013
• Published: 09/11/2014
• Est. Priority Date: 03/10/2013
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: ZHANG, Yang, STEENSTRA, Jack B.
• Granted Patent: US 9,232,640 B2
• Time in Patent Office: Days
• US Class Current: 361/729
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.

Claims

1. A printed circuit board assembly comprising:

a printed circuit board, the printed circuit board comprising;

a plurality of conductive layers; and

a plurality of dielectric layers, each dielectric layer of the plurality of dielectric layers disposed between a pair of conductive layers in the plurality of conductive layers; and

wherein each conductive layer in the plurality of conductive layers includes a first portion and a second portion separated by a gap; and

wherein gaps in alternating conductive layers are misaligned.

2. The printed circuit board assembly of claim 1, wherein the first portion is shorter than the second portion.

3. The printed circuit board assembly of claim 1, wherein the first portion is substantially thermally isolated from the second portion.

4. The printed circuit board assembly of claim 1, wherein lengths of at least some first portions of the plurality of conductive layers are the same.

5. The printed circuit board assembly of claim 1, further comprising a wireless communication module, integrally connected to and in communication with the printed circuit board, adapted to establish a wireless communication link with an external device.

6. The printed circuit board assembly of claim 5, further comprising a data collection module integrally connected to and in communication with the printed circuit board.

7. The printed circuit board assembly of claim 6, wherein the data collection module is a blood glucose module configured to measure a blood glucose level.

8. The printed circuit board assembly of claim 1, wherein a ground plane is formed upon a layer of the printed circuit board.

9. The printed circuit board assembly of claim 8, further comprising one or more RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the one or more RF capacitors maintaining continuity of the ground plane.

10. The printed circuit board assembly of claim 8, further comprising a metal trace connected to the ground plane creating a DC connection.

11. The printed circuit board assembly of claim 1, wherein the misaligned gaps form a curvature pattern.

12. The printed circuit board assembly of claim 1, wherein the misaligned gaps form a pattern of integrally connected straight segments.

13. A method of manufacturing a printed circuit board assembly, comprising:

providing a printed circuit board;

providing a plurality of conductive layers on the printed circuit board, each conductive layer having a first portion and a second portion separated by a gap where gaps in alternating conductive layers are misaligned; and

providing a plurality of dielectric layers on the printed circuit board, each dielectric layer of the plurality of dielectric layers disposed between a pair of conductive layers in the plurality of conductive layers.

14. The method of claim 13, wherein the first portion is shorter than the second portion.

15. The method of claim 13, wherein the first portion is substantially thermally isolated from the second portion.

16. The method of claim 13, wherein lengths of at least some first portions of the plurality of conductive layers are the same.

17. The method of claim 13, further comprising providing a wireless communication module, integrally connected to and in communication with the printed circuit board, adapted to establish a wireless communication link with an external device.

18. The method of claim 17, further comprising providing a data collection module integrally connected to and in communication with the printed circuit board.

19. The method of claim 18, wherein the data collection module is a blood glucose module configured to measure a blood glucose level.

20. The method of claim 13, wherein a ground plane is formed upon a layer of the printed circuit board.

21. The method of claim 20, further comprising providing one or more RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the one or more RF capacitors maintaining continuity of the ground plane.

22. The method of claim 20, further comprising providing a metal trace connected to the ground plane creating a DC connection.

23. The method of claim 13, wherein the misaligned gaps form a curvature pattern.

24. The method of claim 13, wherein the misaligned gaps form a pattern of integrally connected straight segments.

25. A printed circuit board assembly comprising:

a printed circuit board, the printed circuit board comprising;

a plurality of conductive means; and

a plurality of dielectric means, each dielectric means of the plurality of dielectric means disposed between a pair of conductive means in the plurality of conductive means; and

wherein each conductive means in the plurality of conductive means includes a first portion and a second portion separated by a gap; and

wherein gaps in alternating conductive means are misaligned.

26. The printed circuit board assembly of claim 25, wherein the first portion is shorter than the second portion.

27. The printed circuit board assembly of claim 25, wherein the first portion is substantially thermally isolated from the second portion.

28. The printed circuit board assembly of claim 25, lengths of at least some first portions of the plurality of conductive layers are the same.

29. The printed circuit board assembly of claim 25, further a wireless means communication, integrally connected to and in communication with the printed circuit board, adapted to establish a wireless communication link with an external device.

30. The printed circuit board assembly of claim 29, further comprising a data collection means integrally connected to and in communication with the printed circuit board.

31. The printed circuit board assembly of claim 30, wherein the data collection means is a blood glucose module configured to measure a blood glucose level.

32. The printed circuit board assembly of claim 25, wherein a ground plane is formed upon a layer of the printed circuit board.

33. The printed circuit board assembly of claim 32, further comprising one or more RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the one or more RF capacitors maintaining continuity of the ground plane.

34. The printed circuit board assembly of claim 32, further comprising a metal trace connected to the ground plane creating a DC connection.

35. The printed circuit board assembly of claim 25, wherein the misaligned gaps form a curvature pattern.

36. The printed circuit board assembly of claim 25, wherein the misaligned gaps form a pattern of integrally connected straight segments.