LIGHT EMITTING PACKAGE AND LED BULB
First Claim
Patent Images
1. A structure comprising:
- a first chip mounting portion comprising a first surface and a second surface;
a second chip mounting portion comprising a first surface and a second surface; and
light emitting diode (LED) chips mounted on the first surface and the second surface of the first chip mounting portion and on the first surface and the second surface of the second chip mounting portion, wherein the arrangement density of the LED chips on the second surface of the first chip mounting portion near the second chip mounting portion is less than the arrangement density of the LED chips on the second surface of the first chip mounting portion away the second chip mounting portion.
1 Assignment
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Accused Products
Abstract
A light emitting package includes a metal plate, a plurality of LED chips, a plurality of leads and a molding compound. The metal plate has a first surface and a second surface, and is bent into two chip mounting portions, wherein an inclination angle is between the chip mounting portions. The LED chips are mounted on the first surface and the second surface of the chip mounting portions. The leads are disposed adjacent to the metal plate and electrically connected to the LED chips. The molding compound encapsulates the LED chips and a part of the lead.
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Citations
20 Claims
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1. A structure comprising:
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a first chip mounting portion comprising a first surface and a second surface; a second chip mounting portion comprising a first surface and a second surface; and light emitting diode (LED) chips mounted on the first surface and the second surface of the first chip mounting portion and on the first surface and the second surface of the second chip mounting portion, wherein the arrangement density of the LED chips on the second surface of the first chip mounting portion near the second chip mounting portion is less than the arrangement density of the LED chips on the second surface of the first chip mounting portion away the second chip mounting portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A structure comprising:
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a first chip mounting portion comprising a first surface and a second surface; a second chip mounting portion comprising a first surface and a second surface; and light emitting diode (LED) chips mounted on the first surface and the second surface of the first chip mounting portion and on the first surface and the second surface of the second chip mounting portion, wherein an inclination angle exists between the first chip mounting portion and the second chip mounting portion, the inclination angle depending on a light emitting angle of the LED chips. - View Dependent Claims (16, 17, 18)
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19. A method comprising:
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providing a metal plate comprising a first chip mounting portion and a second chip mounting portion; mounting light emitting diode (LED) chips to a first surface of the first chip mounting portion and a first surface of the second chip mounting portion; mounting LED chips to a second surface of the first chip mounting portion and a second surface of the second chip mounting portion; and bending the metal plate along a middle line between the first chip mounting portion and the second chip mounting portion. - View Dependent Claims (20)
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Specification