LIGHT EMITTING PACKAGE AND LED BULB

• US 20140254181A1
• Filed: 03/07/2013
• Published: 09/11/2014
• Est. Priority Date: 03/07/2013
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Chang, Hsiao-Chuan, Tsai, Tsung-Yueh
• Granted Patent: US 9,618,191 B2
• Time in Patent Office: Days
• US Class Current: 362/382
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 29/77 with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/12 characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A light emitting package includes a metal plate, a plurality of LED chips, a plurality of leads and a molding compound. The metal plate has a first surface and a second surface, and is bent into two chip mounting portions, wherein an inclination angle is between the chip mounting portions. The LED chips are mounted on the first surface and the second surface of the chip mounting portions. The leads are disposed adjacent to the metal plate and electrically connected to the LED chips. The molding compound encapsulates the LED chips and a part of the lead.

Claims

1. A structure comprising:

a first chip mounting portion comprising a first surface and a second surface;

a second chip mounting portion comprising a first surface and a second surface; and

light emitting diode (LED) chips mounted on the first surface and the second surface of the first chip mounting portion and on the first surface and the second surface of the second chip mounting portion, wherein the arrangement density of the LED chips on the second surface of the first chip mounting portion near the second chip mounting portion is less than the arrangement density of the LED chips on the second surface of the first chip mounting portion away the second chip mounting portion.

2. The structure of claim 1 wherein the arrangement density is the number of LED chips per unit area of the second surface of the first chip mounting portion.

3. The structure of claim 1 wherein the arrangement density of the LED chips on the second surface of the second chip mounting portion near the first chip mounting portion is less than the arrangement density of the LED chips on the second surface of the second chip mounting portion away the first chip mounting portion.

4. The structure of claim 1 wherein the arrangement density of the LED chips on the first surface of the first chip mounting portion and the first surface of the second chip mounting portion is uniform.

5. The structure of claim 1 wherein an inclination angle exists between the first chip mounting portion and the second chip mounting portion.

6. The structure of claim 5 wherein the inclination angle is between 30 and 150 degrees.

7. The structure of claim 5 wherein the inclination angle is the angle between a plane defined by the second surface of the first chip mounting portion and a plane defined by the second surface of the second chip mounting portion.

8. The structure of claim 5 wherein the inclination angle depends on a light emitting angle of the LED chips.

9. The structure of claim 1 further comprising:

a metal plate comprising the first chip mounting portion and the second chip mounting portion, the metal plate comprising a central bending portion between the first chip mounting portion and the second chip mounting portion.

10. The structure of claim 9 wherein the metal plate further comprises an extending portion, the structure further comprising:

a heat sink comprising a V shaped opening, the extending portion being inserted into the V shaped opening of the heat sink.

11. The structure of claim 1 further comprising:

a first metal plate comprising the first chip mounting portion; and

a second metal plate comprising the second chip mounting portion, the first metal plate being separated from the second metal plate.

12. The structure of claim 11 further comprising:

a heat sink comprising an opening comprising a first groove and a second groove, the first metal plate being inserted into the first groove, and the second metal plate being inserted into the second groove.

13. The structure of claim 1 further comprising:

a heat sink comprising an opening; and

a rod fixed to the light emitting package, the rod being inserted into the opening of the heat sink.

14. The structure of claim 1 further comprising:

leads disposed adjacent to the metal plate and electrically connected to the LED chips; and

a molding compound encapsulating the LED chips and a part of the leads.

15. A structure comprising:

a first chip mounting portion comprising a first surface and a second surface;

a second chip mounting portion comprising a first surface and a second surface; and

light emitting diode (LED) chips mounted on the first surface and the second surface of the first chip mounting portion and on the first surface and the second surface of the second chip mounting portion, wherein an inclination angle exists between the first chip mounting portion and the second chip mounting portion, the inclination angle depending on a light emitting angle of the LED chips.

16. The structure of claim 15 wherein the inclination angle is the angle between a plane defined by the second surface of the first chip mounting portion and a plane defined by the second surface of the second chip mounting portion.

17. The structure of claim 15 further comprising:

a metal plate comprising the first chip mounting portion and the second chip mounting portion, the metal plate comprising a central bending portion between the first chip mounting portion and the second chip mounting portion.

18. The structure of claim 15 further comprising:

a first metal plate comprising the first chip mounting portion; and

a second metal plate comprising the second chip mounting portion, the first metal plate being separated from the second metal plate.

19. A method comprising:

providing a metal plate comprising a first chip mounting portion and a second chip mounting portion;

mounting light emitting diode (LED) chips to a first surface of the first chip mounting portion and a first surface of the second chip mounting portion;

mounting LED chips to a second surface of the first chip mounting portion and a second surface of the second chip mounting portion; and

bending the metal plate along a middle line between the first chip mounting portion and the second chip mounting portion.

20. The method of claim 19 where the bending comprises forming an inclination angle between the first chip mounting portion and the second chip mounting portion, the inclination angle depending on a light emitting angle of the LED chips.