WAVEGUIDE AND SEMICONDUCTOR PACKAGING
First Claim
1. A method of fabricating sub-millimeter wavelength (SMMW) devices, comprising the steps of:
- batch processing a first wafer to include one or more DC through vias;
depositing one or more solder bumps on an upper surface of the first wafer;
batch processing a second wafer to create one or more cavities aligned with the solder bumps;
bonding a lower surface of the second wafer to the upper surface of the first wafer;
batch processing one or more third wafers of semiconductor material to form monolithic microwave integrated circuit (MMIC) chips;
dicing the one or more third wafers into individual MMIC chips; and
placing one or more MMIC chips into the cavities of the second wafer.
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Accused Products
Abstract
A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
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Citations
22 Claims
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1. A method of fabricating sub-millimeter wavelength (SMMW) devices, comprising the steps of:
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batch processing a first wafer to include one or more DC through vias; depositing one or more solder bumps on an upper surface of the first wafer; batch processing a second wafer to create one or more cavities aligned with the solder bumps; bonding a lower surface of the second wafer to the upper surface of the first wafer; batch processing one or more third wafers of semiconductor material to form monolithic microwave integrated circuit (MMIC) chips; dicing the one or more third wafers into individual MMIC chips; and placing one or more MMIC chips into the cavities of the second wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A pixel for a sub-millimeter wavelength (SMMW) focal plane array (FPA) comprising:
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a chip interface comprising DC through vias, and solder bumps on the upper surface of the chip interface that are aligned with the DC through vias; a waveguide comprising one or more cavities aligned with the solder bumps on the upper surface of the chip interface; one or more monolithic microwave integrated circuit (MMIC) chips inserted into the cavities of the waveguide; and an antenna aligned with at least one of the cavities of the waveguide; wherein SMMW signals are received through the antenna, transmitted through the cavities in the waveguide and processed by the MMIC chips. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A sub-millimeter wavelength (SMMW) focal plane array (FPA) comprising;
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a first layer comprising a plurality of electrical connections from one side of the layer to the other; a second layer comprising a plurality of waveguide cavities aligned with the electrical connections of the first layer; a plurality of monolithic microwave integrated circuits (MMICs) chips inserted into the plurality of waveguide cavities and operatively connected with the electrical connections of the first layer; and a third layer comprising a plurality of antennas, said plurality of antennas aligned with said plurality of waveguide cavities. - View Dependent Claims (19, 20, 21, 22)
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Specification