Self-Aligned Passivation of Active Regions
First Claim
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1. A method comprising:
- forming a semiconductor fin;
performing a first passivation step on a top surface of the semiconductor fin using a first passivation species;
performing a second passivation step on sidewalls of the semiconductor fin using a second passivation species different from the first passivation species;
forming a gate stack on a middle portion of the semiconductor fin; and
forming a source or a drain region on a side of the gate stack, wherein the source or drain region and the gate stack form a Fin Field-Effect Transistor (FinFET).
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Abstract
A method includes forming a semiconductor fin, performing a first passivation step on a top surface of the semiconductor fin using a first passivation species, and performing a second passivation step on sidewalls of the semiconductor fin using a second passivation species different from the first passivation species. A gate stack is formed on a middle portion of the semiconductor fin. A source or a drain region is formed on a side of the gate stack, wherein the source or drain region and the gate stack form a Fin Field-Effect Transistor (FinFET).
16 Citations
20 Claims
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1. A method comprising:
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forming a semiconductor fin; performing a first passivation step on a top surface of the semiconductor fin using a first passivation species; performing a second passivation step on sidewalls of the semiconductor fin using a second passivation species different from the first passivation species; forming a gate stack on a middle portion of the semiconductor fin; and forming a source or a drain region on a side of the gate stack, wherein the source or drain region and the gate stack form a Fin Field-Effect Transistor (FinFET). - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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performing a first passivation step on a top surface of a semiconductor region using a first passivation species, wherein the semiconductor region is between isolation regions, with the top surface of the semiconductor region being substantially level with top surfaces of the isolation regions; after the first passivation step, recessing the isolation regions, wherein a top portion of the semiconductor region higher than top surfaces of remaining portions of the isolation regions forms a semiconductor fin; after the step of recessing, performing a second passivation step on the semiconductor fin using a second passivation species different from the first passivation species; forming a gate stack on a middle portion of the semiconductor fin; and forming a source or a drain region on a side of the gate stack to form a Fin Field-Effect Transistor (FinFET). - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method comprising:
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forming a semiconductor fin; performing a first passivation step on a top surface and sidewalls of the semiconductor fin using a first passivation species, wherein the first passivation species comprises a first element and a second element, and wherein the first element is more preferred by the top surface of the semiconductor fin than by the sidewalls of the semiconductor fin, and wherein the second element is more preferred by the sidewalls of the semiconductor fin than by the top surface of the semiconductor fin; forming a gate stack on a middle portion of the semiconductor fin; and forming a source or a drain region on a side of the gate stack to form a Fin Field-Effect Transistor (FinFET). - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification