METHOD FOR EMBEDDING ELECTRONIC DEVICE AND WEARABLE APPARATUS USING THE SAME

• US 20140259271A1
• Filed: 03/17/2014
• Published: 09/18/2014
• Est. Priority Date: 03/15/2013
• Status: Abandoned Application

• Current Assignee: Cape Evolution Limited
• Original Assignee: Cape Evolution Limited
• Inventors: Cox, Christopher David, Chirouter, Benoit
• Application Number:
  US14/215,081
• Publication Number:
  US 20140259271A1
• Time in Patent Office: Days
• US Class Current: 2/69
• CPC Class Codes: B29C 45/00 Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection blow-moulding B29C49/06
• CPC Class Codes: B29C 64/124 using layers of liquid which are selectively solidified
• CPC Class Codes: B29C 65/028 making use of inherent heat, i.e. the heat for the joining comes from the moulding process of one of the parts to be joined
• CPC Class Codes: B29C 70/70 Completely encapsulating inserts B29C70/86 takes precedence
• CPC Class Codes: B29D 12/02 Spectacle frames constructional form G02C
• CPC Class Codes: B29L 2012/005 Spectacle frames
• CPC Class Codes: G02C 11/10 Electronic devices other than hearing aids
• CPC Class Codes: G02C 13/001 Assembling; Repairing
• CPC Class Codes: G02C 5/008 Spectacles frames characterized by their material, material structure and material properties

Abstract

Methods for embedding an electronic device in a frame enclosure and wearable apparatuses using the same are disclosed. The method includes: providing a first substrate and a second substrate; shaping at least one of the first substrate or the second substrate according to a second predetermined pattern; disposing the electronic device between the first substrate and the second substrate; compressing the first substrate and the second substrate together, wherein the electronic device is sandwiched by the compression between the first substrate and the second substrate; and heating the assembly of the first substrate, the electronic device, and the second substrate.

Claims

1. A method for embedding an electronic device in a frame enclosure of a wearable apparatus, comprising:

providing a substrate and heating the substrate into a melted state;

shaping the melted substrate according to a first predetermined pattern;

disposing the electronic device on the melted substrate before cooling; and

cooling the melted substrate with the embedded electronic device.

2. The method according to claim 1, wherein the first predetermined pattern is formed by a stereolithography process or an injection process according to the frame enclosure in the wearable apparatus.

3. The method according to claim 1, wherein a material of the substrate is plastic.

4. The method according to claim 1, wherein a material of the substrate is acetate.

5. A method for embedding an electronic device in a frame enclosure of a wearable apparatus, comprising:

providing a first substrate and a second substrate;

shaping at least one of the first substrate or the second substrate according to a second predetermined pattern;

disposing the electronic device between the first substrate and the second substrate;

compressing the first substrate and the second substrate together, wherein the electronic device is sandwiched by the compression between the first substrate and the second substrate; and

heating the assembly of the first substrate, the electronic device, and the second substrate.

6. The method according to claim 5, wherein the second predetermined pattern is formed by a plurality of cylindrical patterners shaping at least one of the first or second substrate to facilitate embedding of the electronic device.

7. The method according to claim 5, wherein a material of the substrate is plastic.

8. The method according to claim 5, wherein a material of the substrate is acetate.

9. A wearable apparatus, comprising:

a frame configured to be wearable on a user, the frame comprising a bridge portion having a first mountable section, a first arm portion having a second mountable section, and a second arm portion having a third mountable section; and

a plurality of capsules configured to be mounted on the first mountable section, the second mountable section, and the third mountable section of the frame,

wherein the first arm portion has a first end supported by an ear of the user, and the second arm portion has a second end supported by the other ear of the user,

wherein at least one of the first end or the second end is detachable from the frame, and the first end or the second end embeds an electronic device by providing a substrate and heating the substrate into a melted state, shaping the melted substrate according to a first predetermined pattern, disposing the electronic device on the melted substrate before cooling; and

cooling the melted substrate with the embedded electronic device.

10. A wearable apparatus, comprising:

a frame configured to be wearable on a user, the frame comprising a bridge portion having a first mountable section, a first arm portion having a second mountable section, and a second arm portion having a third mountable section; and

a plurality of capsules configured to be mounted on the first mountable section, the second mountable section, and the third mountable section of the frame,

wherein the first arm portion has a first end supported by an ear of the user, and the second arm portion has a second end supported by the other ear of the user,

wherein at least one of the first end or the second end is detachable from the frame, and the first end or the second end embeds an electronic device by providing a first substrate and a second substrate, shaping at least one of the first substrate or the second substrate according to a second predetermined pattern, disposing the electronic device between the first substrate and the second substrate, compressing the first substrate and the second substrate together, wherein the electronic device is sandwiched by the compression between the first substrate and the second substrate; and

heating the assembly of the first substrate, the electronic device, and the second substrate.