METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL

• US 20140259640A1
• Filed: 03/14/2013
• Published: 09/18/2014
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Sumida Corporation
• Original Assignee: Sumida Corporation
• Inventors: SAKAMOTO, Shinichi, MALCOLM, Douglas James
• Granted Patent: US 9,087,634 B2
• Time in Patent Office: Days
• US Class Current: 29/602.1
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2828 Construction of conductive connections, of leads
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 41/02 for manufacturing cores, coils, or magnets H01F41/14 takes precedence; for dynamo-electric machines H02K15/00
• CPC Class Codes: H01F 41/0246 Manufacturing of magnetic circuits by moulding or by pressing powder magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36
• CPC Class Codes: H01F 41/064 Winding non-flat conductive wires, e.g. rods, cables or cords
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm² to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

Claims

1. A method for manufacturing an electronic component comprising:

placing a T-shaped core and an air-core coil in a mold;

injecting a mixture of a composite magnetic material and a resin into the mold so that the T-shaped core and the air-core coil are embedded by the mixture;

heating the mixture at a first temperature;

adjusting an outer shape while removing excessive mixture, and

hardening the mixture.

2. The method for manufacturing an electronic component according to claim 1, wherein

the first temperature is in a range of 60 to 100 C.°

, and

the heating process is performed for 5 to 120 minutes.

3. The method for manufacturing an electronic component according to claim 1, wherein

the hardening process is performed by heating the mixture at a second temperature in a range of 120 to 200 C.°

for 10 to 90 minutes.

4. The method for manufacturing an electronic component according to claim 1 further comprising:

winding a round wire to form the air-core coil, and

flattening both ends of the wire.

5. The method for manufacturing an electronic component according to claim 1 further comprising:

winding a flat rectangular wire to form the air-core coil, wherein

an inside diameter of the air-core coil is larger than an outside diameter of a core part of the T-shaped core.

6. The method for manufacturing an electronic component according to claim 1 further comprising:

applying solder at both ends of end wires of the air-core coil,

placing the air-core coil on a first surface of the T-shaped core,

bending the end wires at a side of the T-shaped core, and

fixing both ends to a second surface of the T-shaped core opposite the first surface.

7. The method for manufacturing an electronic component according to claim 1 further comprising:

applying a pressure of 0.1 to 20.0 kg/cm² to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

8. The method for manufacturing an electronic component according to claim 1, wherein

the injecting process is performed by a dispenser that includes:

a discharge opening that discharges the mixture;

a material tank that stores the mixture;

a flow passage in which the mixture flows;

a valve that is provided in the flow passage and controls a flow of the mixture;

a valve driving unit that opens and closes the valve; and

a mixer that is provided at a trailing end of the flow passage and that mixes the mixture, and that supplies the mixture toward the discharge opening.

9. The method for manufacturing an electronic component according to claim 1 further comprising:

removing excessive mixture from a surface of the mixture by a sharp edge of a remover before the heating is performed.

10. The method for manufacturing an electronic component according to claim 9 further comprising:

applying a pressure of 0.1 to 20.0 kg/cm² to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

11. The method for manufacturing an electronic component according to claim 9 wherein

the sharp edge of the remover slides along the top surface of the mixture at an angle of 0 to 80 degrees with respect to a surface of the metal mold and applies a pressure of 0.1 to 20.0 kg/cm² to the mixture.

12. A method for manufacturing an electronic component comprising:

placing an air-core coil wrapped core in a mold;

embedding the air-core wrapped core in a mixture of a composite magnetic material and a resin in the mold;

heating the mixture at a first temperature;

adjusting an outer shape while removing excessive mixture, and

hardening the mixture.

13. The method for manufacturing an electronic component according to claim 12, wherein

the first temperature is in a range of 60 to 100 C.°

, and

the heating process is performed for 5 to 120 minutes.

14. The method for manufacturing an electronic component according to claim 13, wherein

the hardening process is performed by heating the mixture at a second temperature in a range of 120 to 200 C.°

for 10 to 90 minutes.

15. The method for manufacturing an electronic component according to claim 12 further comprising:

applying a pressure of 0.1 to 20.0 kg/cm² to the mixture before the hardening process.

16. The method for manufacturing an electronic component according to claim 12 further comprising:

polished an outside of the hardened mixture.

17. The method for manufacturing an electronic component according to claim 16, wherein

the remover slides along the top surface of the mixture at an angle of 0 to 80 degrees with respect to a surface of the metal mold and applies a pressure of 0.1 to 20.0 kg/cm² to the mixture.