DEVICE AND SYSTEM FOR INTEGRATED SENSOR SYSTEM (ISS)

• US 20140260704A1
• Filed: 03/07/2014
• Published: 09/18/2014
• Est. Priority Date: 03/15/2013
• Status: Abandoned Application

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: LLOYD, Stephen, LIM, James
• Application Number:
  US14/201,729
• Publication Number:
  US 20140260704A1
• Time in Patent Office: Days
• US Class Current: 73/865.8
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15184 in different layers of the multilayer substrate

Abstract

The present invention is directed toward a device and system having a sensor hub capable of receiving measurement outputs from a plurality of sensors and processing the measurements for output to other devices, from a single chip arrangement. The sensor hub provides for facilitating efficient communication among the sensors for improved high-level features, such as interpreting gestures or actions according to the context.

Claims

1. A device comprising:

a plurality of sensors formed on a first silicon substrate; and

a sensor hub coupled to the plurality of sensors and formed on a second silicon substrate,

wherein the sensor hub receives measurement outputs from the plurality of sensors, the sensor hub comprises a plurality of processors coupled to the plurality of sensors to process the measurement outputs,

wherein the first silicon substrate is attached to the second silicon substrate and the first silicon substrate being electrically connected to the second silicon substrate to form a single semiconductor chip.

2. The device of claim 1 further comprising a memory to store the measurement outputs.

3. The device of claim 1 further comprising a memory to store processed data.

4. The device of claim 1 further comprising a memory to store instructions.

5. The device of claim 1, further comprising a memory, wherein the memory is formed on the single semiconductor chip.

6. The device of claim 1, wherein the first silicon substrate and the second silicon substrate are substantially parallel.

7. The device of claim 1, wherein the first silicon substrate and the second silicon substrate are vertically stacked.

8. The device of claim 4, wherein a portion of the instructions is a sensor fusion algorithm.

9. The device of claim 8, wherein the sensor fusion algorithm is executed on the at least one of the plurality of processors.

10. The device of claim 8, wherein the sensor fusion algorithm is executed on a processor external to the device.

11. The device of claim 1, wherein the plurality of sensors is grouped based on the type of sensor.

12. The device of claim 1, wherein a portion of the sensor hub is on a third silicon substrate.

13. The device of claim 12, wherein the first silicon substrate and the third silicon substrate are substantially parallel.

14. The device of claim 1, wherein the sensor hub includes an analog to digital (A/D) converter.

15. The device of claim 1, wherein the sensor hub includes a real time clock (RTC).

16. The device of claim 1, wherein the sensor hub includes a system clock oscillator.

17. The device of claim 1, wherein the sensor hub further includes a power management circuit.

18. The device of claim 1, wherein an interrupt signal is generated to at least one of the one or more processors.

19. The device of claim 1, wherein an interrupt is generated to an external processor.

20. The device of claim 1, wherein the plurality of sensors are utilized for messaging a specific event.

21. The device of claim 1, wherein the plurality of sensors are utilized for detecting contextual changes.

22. The device of claim 1, wherein the plurality of sensors are utilized for detecting activities.

23. The device of claim 22, the activities detected comprise any of sleeping, waking up, walking, running, biking, participating in a sport, walking on stairs, driving, flying, training, exercising cooking, watching a television, reading, working at a computer, and eating.

24. The device of claim 1, wherein the plurality of sensors are utilized for detecting a location.

25. The device of claim 24, locations detected include any of a home, a workplace, a moving vehicle, indoor, outdoor, a meeting room, a store, a mall, a kitchen, a living room, and bedroom.

26. The device of claim 1, wherein the plurality of sensors and at least one processor are utilized for detecting a basic unit.

27. The device of claim 23, wherein the basic unit detected comprises any of a velocity, acceleration, gravity, elevation, environmental motion/vibrations, background noise, audio signature, detecting keywords, images, motion gestures, image gesture, ambient light, body temperature, ambient temperature, humidity, rotation, orientation, heading, ambient pressure, air quality, and flat tire detection.

28. The device of claim 27, wherein the orientation comprises any of user orientation and device orientation.

29. The device of claim 27, wherein the air quality comprises any of an amount of oxygen (O2), an amount of carbon dioxide (Co2) or a particle count.

30. The device of claim 1, wherein the plurality of processors comprises any one of an audio processor, an image processor, a motion processor, a touch processor, a location processor, a wireless processor, a radio processor, a graphics processor, a power management processor, an environmental processor, an activity processor, and access point (AP), and a microcontroller unit (MCU).

48. The device of claim 1, wherein the plurality of sensors are utilized for detecting a basic unit.

49. The device of claim 48, wherein the basic unit detected comprises any of a velocity, acceleration, gravity, elevation, environmental motion/vibrations, background noise, audio signature, detecting keywords, images, motion gestures, image gesture, ambient light, body temperature, ambient temperature, humidity, rotation, orientation, heading, ambient pressure, air quality, and flat tire detection.

50. The device of claim 49, wherein the orientation comprises any of user orientation and device orientation.

51. The device of claim 49, wherein the air quality comprises any of an amount of oxygen (O2), an amount of carbon dioxide (Co2) or a particle count.

31. An integrated sensor system comprising:

a plurality of embedded sensors; and

a sensor hub, wherein the plurality of embedded sensors and the sensor hub are on a single chip;

the sensor hub comprises a plurality of processors coupled to the plurality of embedded sensors to process measurement outputs from the plurality of embedded sensors and external sensors.

32. The device of claim 31 further comprising a memory to store the measurement outputs.

33. The device of claim 31 further comprising a memory to store processed data.

34. The device of claim 31 further comprising a memory to store instructions.

35. The device of claim 34, wherein the instructions is a sensor fusion algorithm.

36. The device of claim 31, wherein the sensor hub includes an analog to digital (A/D) converter.

37. The device of claim 31, wherein the sensor hub includes a real time clock (RTC).

38. The device of claim 31, wherein the sensor hub includes a system clock oscillator.

39. The device of claim 31, wherein the sensor hub includes a power management circuit.

40. The device of claim 31, wherein an interrupt is generated to at least one of the one or more processors.

41. The device of claim 31, wherein an interrupt is generated to an external processor.

42. The device of claim 31, wherein the plurality of sensors are utilized for messaging a specific event.

43. The device of claim 31, wherein the plurality of sensors are utilized for detecting contextual changes.

44. The device of claim 31, wherein the plurality of sensors are utilized for detecting activities.

45. The device of claim 44, activities detected comprise any of sleeping, waking up, walking, running, biking, participating in a sport, walking on stairs, driving, flying, training, exercising cooking, watching a television, reading, working at a computer, and eating.

46. The device of claim 31, wherein the plurality of sensors are utilized for detecting a location.

47. The device of claim 46, locations detected include any of a home, a workplace, a moving vehicle, indoor, outdoor, a meeting room, a store, a mall, a kitchen, a living room, and bedroom.

52. The device of claim 31, wherein the plurality of processors comprises any of an audio processor, an image processor, a motion processor, a touch processor, a location processor, a wireless processor, a radio processor, a graphics processor, a power management processor, an environmental processor, an activity processor, and access point (AP), and a microcontroller unit (MCU).

53. An integrated sensor system comprising:

a plurality of embedded sensors; and

a sensor hub, the sensor hub comprises a plurality of processors coupled to the plurality of embedded sensors to process measurement outputs from the plurality of embedded sensors and external sensors and memory;

wherein the memory and the plurality of embedded sensors are on a first chip and the processors are on a second chip.

54. An integrated sensor system comprising:

a plurality of embedded sensors; and

a sensor hub, the sensor hub comprises a plurality of processors coupled to the plurality of embedded sensors to process measurement outputs from the plurality of embedded sensors and external sensors and memory;

wherein a first portion of the plurality of processors and the memory are on a first chip and a second portion of the plurality of processors and sensors on a second chip.

55. An integrated sensor system comprising:

a plurality of embedded sensors; and

a sensor hub, the sensor hub comprises a plurality of processors coupled to the plurality of embedded sensors to process measurement outputs from the plurality of embedded sensors and external sensors and memory;

wherein a first portion of the plurality of embedded sensors and the memory are on a first chip and a second portion of the plurality of embedded sensors and the plurality of processors on a second chip.

56. An integrated sensor system comprising:

a plurality of embedded sensors; and

a sensor hub, the sensor hub comprises a plurality of processors coupled to the plurality of embedded sensors to process measurement outputs from the plurality of embedded sensors and external sensors and memory;

wherein a portion of the plurality of embedded sensors, a portion of the plurality of processors and the memory are on a first chip and another portion of the plurality of embedded sensors and another portion of the plurality of processors are on a second chip.

57. An integrated sensor system comprising:

a plurality of embedded sensors; and

a sensor hub, the sensor hub comprises a plurality of processors coupled to the plurality of embedded sensors to process measurement outputs from the plurality of embedded sensors and external sensors and memory;

wherein the memory and the plurality of processors are on are on a first chip and the plurality of embedded sensors are on a second chip.

58. A device comprising:

a plurality of sensors; and

a sensor hub coupled to the plurality of sensors,

wherein the sensor hub receives measurement outputs from the plurality of sensors, the sensor hub comprises a plurality of processors coupled to the plurality of sensors to process the measurement outputs,

wherein the plurality of sensors and the sensor hub are on at least two substrates, wherein the at least two substrates are stacked and electrically connected to the each other to form a single semiconductor chip.

59. The device of claim 58, wherein the at least two substrates comprise a CMOS substrate and a MEMS substrate.

60. The device of claim 58, wherein the plurality of sensors are on one of the at least two substrates and the plurality of processors are on the other of the at least two substrates.

61. The device of claim 58, wherein a first portion of the plurality of sensors are on one of the at least two substrates and a second portion of the plurality of the sensors and the plurality of processors are on the other of the at least two substrates.

62. The device of claim 58, wherein a first portion of the plurality of processors are on one of the at least two substrates and second portion of the plurality of the processors and the plurality of sensors are on the other of the at least two substrates.

63. The device of claim 58, wherein a one portion of the plurality of processors and one portion of the plurality of sensors are on one of the at least two substrates and another portion of the plurality of the processors and another portion of the plurality of sensors are on the other of the at least two substrates.