METHOD AND APPARATUS FOR DYNAMICALLY COOLING ELECTRONIC DEVICES

• US 20140262161A1
• Filed: 03/12/2014
• Published: 09/18/2014
• Est. Priority Date: 03/12/2013
• Status: Abandoned Application

• Current Assignee: David Lind Weigand
• Original Assignee: David Lind Weigand
• Inventors: Weigand, David Lind
• Application Number:
  US14/205,951
• Publication Number:
  US 20140262161A1
• Time in Patent Office: Days
• US Class Current: 165/104.33
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops

Abstract

This invention provides a method and apparatus for device designers to overcome such limitations by incorporating a dynamic fluid cooling system to transfer heat within the device amongst various subsystems and convect the heat externally, versus current static thermal solutions which conductively spread heat in a limited manner at significant cost. Specifically these dynamic fluid cooling methods and apparatus for electronic device enable increased performance and decreased cost across many of the device subsystems including but not limited to: electronics, integrated circuits, batteries, display panels, touch panels, lighting, audio transducers, imaging, flash LEDs and chargers.

Claims

1. A fluid thermal cooling apparatus for an electronic device, comprising:

(a) an apparatus to transfer, control and circulate thermal cooling fluid within an electronic device and its subsystems, via

(b) a thermal fluid cooling topology with integrated circuit elements and fluid conduits and radiators integral to the device providing

(c) increased performance and decreased cost across many of the device subsystems including but not limited to;

electronics, integrated circuits, batteries, display panels, touch panels, lighting, audio transducers, imagers, flash LEDs, sensors and chargers;

thereby enabling effective thermal cooling of the device and its critical performance subsystems.

2. A method of device thermal cooling based on dynamic, real-time device orientation and movement, comprising:

(a) providing Accelerometer, Gyroscope and other orientation based sensors possibly in conjunction with thermal sensors, controlled by software and hardware control mechanisms

(b) directing thermal cooling to the high human touch areas and optimal thermal dissipation configuration of the electronic device based on device real-time orientation

(c) providing for dynamic, real-time optimal thermal cooling based on movement of device and relative orientation cooling using the Gyroscope, Accelerometer and other orientation and device movement sensors detect when the electronic device is moving and how it is moving so software can dynamically direct thermal cooling fluid to those areas anticipated to become high human touch areas.

3. A method of thermal cooling based on dynamic real-time human proximity detection, comprising:

(a) providing the sensors in the proximity sensors suite are comprised of, but not limited to, Automatic Light Sensor (ALS), Proximity sensors, Imagers, Specific Absorption Radiation (SAR), oximeters and other proximity bio-sensors possibly in conjunction with thermistors and software/Hardware control mechanisms

(b) directing thermal cooling to the high human touch areas of the electronic device based on real-time human proximity of the device so software can dynamically direct thermal cooling fluid to those areas anticipated to become high touch areas wherein, device software can maintain a history of device orientation and human proximity events so the electronic device learns how it is typically used, oriented and held so the software can optimally control the dynamic cooling configuration.