TRANSFERABLE FILM INCLUDING LOGIC CIRCUIT, AND METHODS FOR PROVIDING TRANSFERABLE FILM

• US 20140263656A1
• Filed: 03/15/2013
• Published: 09/18/2014
• Est. Priority Date: 03/15/2013
• Status: Abandoned Application

• Current Assignee: Illinois Tool Works Inc.
• Original Assignee: Illinois Tool Works Inc.
• Inventors: Schneider, John H., HERRING, WILLIAM A., FISHER, JOSEPH M., ASHTON, DEBORAH, COLELLA, MICHAEL B.
• Application Number:
  US13/838,593
• Publication Number:
  US 20140263656A1
• Time in Patent Office: Days
• US Class Current: 235/488
• CPC Class Codes: B32B 2037/268 Release layers
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: G06K 19/083 Constructional details
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A transferable film includes a carrier layer and an intermediate portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate portion includes the one or more additional layers and a circuit. The one or more additional layers include a graphics layer. The intermediate portion is configured for application thereto of an adhesive layer, whereby the intermediate portion is configured to be interposed between the carrier layer and the adhesive layer. The adhesive layer is configured to adhere to the object for the application of the transferable film to the object.

Claims

1. A transferable film comprising:

a carrier layer configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object; and

an intermediate portion comprising the one or more additional layers and a circuit portion, wherein the one or more additional layers comprise a graphics layer, the intermediate portion configured for application thereto of an adhesive layer whereby the intermediate portion is configured to be interposed between the carrier layer and the adhesive layer, the adhesive layer configured to adhere to the object for the application of the transferable film to the object.

2. The transferable film of claim 1, wherein the circuit portion comprises an integrated circuit, the integrated circuit comprising a logic circuit.

3. The transferable film of claim 2, wherein the integrated circuit is a thin, flexible integrated circuit.

4. The transferable film of claim 2, wherein the circuit portion comprises a radiofrequency identification (RFID) antenna operably connected to the logic circuit, and wherein the intermediate portion includes an optically readable code, the optically readable code configured to correspond to information provided by the logic circuit.

5. The transferable film of claim 1, wherein the circuit portion is interposed between the graphics layer and the adhesive layer, whereby the circuit portion is configured to be positioned beneath the graphics layer relative to an observer of the object when the transferable film is applied to the object, whereby the circuit portion is not visible to the observer.

6. The transferable film of claim 1, wherein the intermediate portion comprises a circuit adhesive layer, the circuit adhesive layer interposed between the graphics layer and the circuit portion and configured to adhere the circuit portion to the graphics layer.

7. The transferable film of claim 1, wherein the intermediate portion comprises a protective top coat layer positioned adjacent the carrier layer.

8. The transferable film of claim 1, wherein the transferable film is configured as a heat transferable film.

9. The transferable film of claim 1, wherein the transferable film is configured as a hot stamped foil.

10. A method for providing a transferable film, the method comprising:

providing a carrier layer, the carrier layer configured to be releasable from the transferable film temporally proximate to an application of the transferable film to an object; and

adding an intermediate portion to the carrier layer, the intermediate portion comprising one or more additional layers and a circuit portion, wherein the one or more additional layers comprise a graphics layer, the intermediate portion configured to receive an adhesive layer, wherein the intermediate portion is interposed between the carrier layer and the adhesive layer, the adhesive layer configured to adhere to an object during the application of the transferable film to the object.

11. The method of claim 10, wherein the circuit portion comprises an integrated circuit operably connected to a radiofrequency (RFID) antenna, wherein the method further comprises:

configuring an optically readable code to correspond to the integrated circuit; and

providing the optically readable code as part of the intermediate portion.

12. The method of claim 11, further comprising:

acquiring identification information corresponding to the integrated circuit;

identifying a corresponding film portion that is scheduled to receive the integrated circuit;

determining optically readable code information to correspond to the integrated circuit; and

applying the optically readable code on the corresponding film portion, the optically readable code corresponding to the optically readable code information corresponding to the integrated circuit.

13. The method of claim 10, wherein the adding an intermediate portion comprises applying the graphics layer to at least one of the carrier layer or a layer that has previously been applied to the carrier layer, and applying the circuit portion after the applying the graphics layer, whereby the circuit portion is configured to be positioned beneath the graphics layer relative to an observer of the object when the transferable film is applied to the object, whereby the circuit portion is not visible to the observer.

14. The method of claim 13, further comprising:

applying a circuit adhesive layer to the graphics layer; and

applying the circuit portion to the circuit adhesive layer.

15. The method of claim 13, wherein the adding the intermediate portion comprises applying a top coat layer to the carrier layer, the top coat layer configured to protect one or more additional aspects of the intermediate portion.

16. A method of providing an object with a transferable film including a circuit, the method comprising:

providing a transferable film, the transferable film comprising a releasable carrier layer, an adhesive layer configured to adhere the film to the object, and an intermediate portion interposed between the carrier layer and the adhesive layer, the intermediate portion including a circuit and one or more additional layers, wherein the one or more additional layers comprise a graphics layer;

applying the transferable film, with the adhesive layer oriented toward the object, to the object;

removing the carrier layer from the transferable film;

acquiring identification information corresponding to the circuit; and

associating the object with the identification information.

17. The method of claim 16, wherein the transferable film is configured as a heat transferable film.

18. The method of claim 16, wherein the transferable film is configured as a hot stamped foil.

19. The method of claim 16, wherein the applying the transferable film comprises applying the transferable film with the circuit interposed between the object and the graphics layer, whereby the circuit is not visible to an observer.

20. The method of claim 16, wherein the circuit comprises a radiofrequency identification (RFID) antenna operably connected with a logic circuit, and wherein the acquiring identification information corresponding to the circuit comprises acquiring the identification information via the RFID antenna.