Geometry Layout and Filter Packaging for System for Wireless, Motion and Position-Sensing, Integrating Radiation Sensor for Occupational and Environmental Dosimetry

• US 20140263989A1
• Filed: 05/28/2014
• Published: 09/18/2014
• Est. Priority Date: 06/01/2012
• Status: Abandoned Application

• Current Assignee: Landauer, Inc. (Fortive Corp.)
• Original Assignee: Landauer, Inc. (Fortive Corp.)
• Inventors: VALENTINO, Daniel J., SALASKY, Mark R.
• Application Number:
  US14/289,208
• Publication Number:
  US 20140263989A1
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: G01T 1/02 Dosimeters G01T1/15 takes precedence
• CPC Class Codes: G01T 7/00 Details of radiation-measuring instruments

Abstract

A device comprising: a substrate, four or more sensor packages mounted on the substrate, and a respective set of one or more filters for each of the four or more sensor packages, wherein each sensor package of the four or more sensor packages comprises one or more radiation sensors mounted therein, wherein each set of filters filter one or more types of radiation entering an exposed side of each of the one or more radiation sensors at angle of at least 60 degrees with respect to a respective axial line through respective centers of each of the one or more radiation sensors.

Claims

1. A device comprising:

a substrate,

four or more sensor packages mounted on the substrate, and

a respective set of one or more filters for each of the four or more sensor packages,

wherein each sensor package of the four or more sensor packages comprises one or more radiation sensors mounted therein,

wherein each set of filters filter one or more types of radiation entering an exposed side of each of the one or more radiation sensors at angle of at least 60 degrees with respect to a respective axial line through respective centers of each of the one or more radiation sensors.

2. The device of claim 1, wherein at least two sensor packages of the four or more sensor packages are mounted on the substrate in a mirror image symmetric arrangement in at least one direction.

3. The device of claim 1, wherein at least four sensor packages of the four or more sensor packages are mounted on the substrate in a mirror image symmetric arrangement in at least one direction.

4. The device of claim 1, wherein at least four sensor packages of the four or more sensor packages are mounted on the substrate in a mirror image symmetric arrangement two perpendicular directions.

5. The device of claim 1, wherein at least four sensor packages of the four or more sensor packages are mounted on the substrate an asymmetric arrangement in at least one direction.

6. The device of claim 1, wherein the substrate is a printed circuit board (PCB) and the one or more radiation sensors are in electronic communication with circuitry of the PCB.

7. The device of claim 1, wherein at least one respective set of one or more filters are mounted in a filter holder that is mounted on the substrate.

8. The device of claim 1, wherein the device comprises a radiation transmissive external case spaced from an exposed side of one filter of each respect set of one or more filters.

9. The device of claim 8, wherein at least one respective set of one or more filters is mounted in a filter holder that is mounted on the radiation transmissive external case.

10. The device of claim 8, wherein at least one respective set of one or more filters is mounted in a filter holder that is part of the radiation transmissive external case.

11. The device of claim 8, wherein the radiation transmissive external case is curved.

12. The device of claim 1, wherein the one or more sensors of at least one sensor package of the four or more sensor packages are a single radiation sensor.

13. The device of claim 1, wherein the one or more sensors of at least one sensor package of the four or more sensor packages are two radiation sensors.