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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

  • US 20140264383A1
  • Filed: 03/14/2014
  • Published: 09/18/2014
  • Est. Priority Date: 03/15/2013
  • Status: Abandoned Application
First Claim
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1. A semiconductor device comprising:

  • a chip-mounting portion having a chip-mounting surface;

    a wide gap semiconductor chip having a main surface and a back surface on an opposite side thereof, having a first electrode formed on the main surface and a second electrode formed on the back surface, and mounted on the chip-mounting surface of the chip-mounting portion;

    a porous first sintered Ag layer provided between the chip-mounting surface and the wide gap semiconductor chip and bonding the chip-mounting portion and the wide gap semiconductor chip;

    a first resin portion covering a surface of the first sintered Ag layer and formed in a fillet shape;

    a first lead electrically connected to the first electrode of the wide gap semiconductor chip; and

    a second lead electrically connected to the second electrode of the wide gap semiconductor chip,wherein the first resin portion covers a part of a side surface of the wide gap semiconductor chip.

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