Low Frequency Response Microphone Diaphragm Structures And Methods For Producing The Same

• US 20140264650A1
• Filed: 03/12/2013
• Published: 09/18/2014
• Est. Priority Date: 03/12/2013
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Liu, Fang, Yang, Kuang L.
• Granted Patent: US 8,946,831 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 3/0078 Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: B81C 1/00523 Etching material

Abstract

A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone'"'"'s frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.

Claims

1. A MEMS microphone comprising:

a substrate comprising a plurality of diaphragm suspension points;

a backplate;

a diaphragm having a top side and an opposing bottom side, the diaphragm defining a diaphragm plane, the diaphragm separated from the plurality of diaphragm suspension points by a spring gap in the diaphragm plane;

a plurality of springs within the diaphragm plane and within the spring gap, each of the plurality of springs coupled to the diaphragm and to a corresponding one of the plurality of diaphragm suspension points, such that the diaphragm is movably suspended from the plurality of diaphragm suspension points when the microphone is in operation, and such that the diaphragm is spaced from the backplate by a variable diaphragm gap; and

a sealing layer laminated on the diaphragm and spanning the spring gap,

wherein the backplate and diaphragm form a variable capacitor of a microphone.

2. The MEMS microphone according to claim 1, wherein the sealing layer further comprises an equalization aperture configured to allow air flow from the top side of the diaphragm to the bottom side of the diaphragm, the equalization aperture having a cross-section in the plane of the diaphragm of not greater than 20 square micrometers.

3. The MEMS microphone according to claim 2, wherein the equalization aperture is disposed adjacent the spring gap, such air may flow from the top side of the diaphragm to the bottom side of the diaphragm through the spring gap.

4. The MEMS microphone according to claim 2, wherein:

the diaphragm further comprises a diaphragm aperture extending from the top side of the diaphragm to the bottom side of the diaphragm; and

the equalization aperture is aligned with the diaphragm aperture, such that air may flow from the top side of the diaphragm to the bottom side of the diaphragm through the diaphragm aperture.

5. The MEMS microphone according to claim 1, wherein the backplate is in the substrate, and the diaphragm is suspended parallel to the substrate.

6. The MEMS microphone according to claim 1, wherein the diaphragm is on the substrate, and the backplate is suspended parallel to the substrate.

7. A packaged microphone comprising:

a package base;

a package lid coupled to the package base, the package lid and package base forming an interior cavity, one of the package base and the package lid comprising an acoustic aperture;

a microphone mounted within the interior cavity, the microphone comprising;

a substrate comprising a backside cavity and a plurality of diaphragm suspension points, the backside cavity spanning the acoustic aperture;

a backplate suspended from the substrate and spanning the backside cavity;

a diaphragm region comprising a diaphragm suspended from the diaphragm suspension points, the diaphragm parallel to the backplate and spaced from the backplate by a variable diaphragm gap and separated from the plurality of diaphragm suspension points by a spring gap;

a sealing layer laminated on the diaphragm and spanning the spring gap, wherein the backplate and diaphragm form a variable capacitor of a microphone.

8. The packaged microphone of claim 7, wherein the sealing layer completely seals the diaphragm region, and wherein the microphone is mounted to the package base, and wherein one of the package base and the lid comprise an equalization aperture.

9. The packaged microphone of claim 8, wherein the package lid comprises the equalization aperture.

10. The packaged microphone of claim 8, wherein the package base comprises the equalization aperture.

11. The packaged microphone of claim 7, wherein the sealing layer completely seals the diaphragm region, and wherein the microphone is mounted to the package lid, and wherein one of the package base and the lid comprise an equalization aperture.

12. The packaged microphone of claim 11, wherein the package lid comprises the equalization aperture.

13. The packaged microphone of claim 11, wherein the package base comprises the equalization aperture.

14. The packaged microphone of claim 7, wherein:

the sealing layer comprises an equalization aperture in fluid communication with a passage through a diaphragm region, such that air may flow from one side of the diaphragm to another to equalize pressure on the diaphragm.

15. The packaged microphone of claim 14, wherein the passage is a spring gap.

16. The packaged microphone of claim 14, wherein the passage is a diaphragm aperture.

17. A method of fabricating a microphone having a sealing layer, comprising:

providing a substrate wafer having a surface;

etching trenches into the surface of the substrate wafer;

covering the surface of the substrate with a sacrificial material, the sacrificial material filling the trenches;

depositing a seal layer on the sacrificial material, the seal layer having a thickness of not greater than 500 nanometers;

etching a seal aperture in the seal layer;

adding additional sacrificial material within the seal aperture such that the additional sacrificial material is contiguous with the sacrificial material;

depositing a diaphragm layer on the seal layer;

etching a spring gap and springs into the diaphragm layer to define a diaphragm region in the diaphragm layer;

etching a backside cavity in the substrate wafer to expose the sacrificial material; and

removing the sacrificial material and the added sacrificial material to release the diaphragm such that the diaphragm is suspended by the springs and is movable relative to the backplate,

wherein diaphragm and backplate form a variable capacitor of a microphone, and the springs suspend the diaphragm when the microphone is in operation, and the seal layer seals the diaphragm region except at the location of the seal aperture.

18. The method of fabricating a microphone of claim 17, wherein etching a spring gap and springs into the diaphragm layer further comprises etching a diaphragm aperture in a location such that the diaphragm aperture will be in fluid communication with the seal aperture after removal of the sacrificial material and the additional sacrificial material.

19. The method of fabricating a microphone of claim 17, wherein the seal aperture has a cross-section of not greater than 20 square micrometers.

20. The method of fabricating a microphone of claim 17, wherein etching the spring gap comprises etching the spring gap such that the spring gap is in fluid communication with the seal aperture after the step of removing the sacrificial material and additional sacrificial material.