SURFACE ROUGHENING TO REDUCE ADHESION IN AN INTEGRATED MEMS DEVICE
First Claim
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1. An integrated MEMS device comprising:
- a MEMS substrate having a first contacting surface; and
a base substrate coupled to the MEMS substrate having a second contacting surface;
wherein at least one of the first contacting surface and the second contacting surface is roughened.
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Abstract
In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness.
40 Citations
18 Claims
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1. An integrated MEMS device comprising:
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a MEMS substrate having a first contacting surface; and a base substrate coupled to the MEMS substrate having a second contacting surface;
wherein at least one of the first contacting surface and the second contacting surface is roughened. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method to reduce surface adhesion forces in an integrated MEMS device;
- the integrated MEMS device including a MEMS substrate having a first contacting surface and a base substrate coupled to the MEMS substrate having a second contacting surface, the method comprising;
etching at least one of the first contacting surface and the second contacting surface to roughen the at least one of the first contacting surface and the second contacting surface. - View Dependent Claims (12, 13, 14, 15, 16, 17)
- the integrated MEMS device including a MEMS substrate having a first contacting surface and a base substrate coupled to the MEMS substrate having a second contacting surface, the method comprising;
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18. A method to reduce surface adhesion forces in an integrated MEMS device;
- the integrated MEMS device including a MEMS substrate having a first contacting surface and a base substrate coupled to the MEMS substrate having a second contacting surface, the method comprising;
depositing a rough film onto one of the first contacting surface and the second contacting surface; and plasma etching the rough film through and into the one of the first contacting surface and the second contacting surface;
wherein the roughness on the rough film is transferred into the one of the first contacting surface and the second contacting surface.
- the integrated MEMS device including a MEMS substrate having a first contacting surface and a base substrate coupled to the MEMS substrate having a second contacting surface, the method comprising;
Specification