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STUBBY PADS FOR CHANNEL CROSS-TALK REDUCTION

  • US 20140264907A1
  • Filed: 03/13/2013
  • Published: 09/18/2014
  • Est. Priority Date: 03/13/2013
  • Status: Active Grant
First Claim
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1. An integrated circuit (IC) package substrate, comprising:

  • a first conductive vertical transition passing through a thickness of the substrate beginning at a first top-side metal feature on a first substrate side and ending at a first bottom-side metal feature on a second substrate side, opposite the first side; and

    a second conductive vertical transition passing through the substrate thickness beginning at a second top-side metal feature on the first substrate side and ending at a second bottom-side metal feature on the second substrate side, wherein the perimeters of first and second bottom-side metal features include complementary capacitive coupling stubs.

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