STUBBY PADS FOR CHANNEL CROSS-TALK REDUCTION
First Claim
1. An integrated circuit (IC) package substrate, comprising:
- a first conductive vertical transition passing through a thickness of the substrate beginning at a first top-side metal feature on a first substrate side and ending at a first bottom-side metal feature on a second substrate side, opposite the first side; and
a second conductive vertical transition passing through the substrate thickness beginning at a second top-side metal feature on the first substrate side and ending at a second bottom-side metal feature on the second substrate side, wherein the perimeters of first and second bottom-side metal features include complementary capacitive coupling stubs.
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Accused Products
Abstract
A metal surface feature, such as a pad, terminating a vertical transition through a substrate, such as an IC package substrate, includes one or more stubs providing high edge surface area to couple with one or more complementary stubs on an adjacent metal surface feature to provide a desired amount of mutual capacitance that may at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent pads is provided for more than two pads to achieve crosstalk reduction of more than one victim-aggressor pair and/or to achieve crosstalk reduction of more than two aggressors. In embodiments, the pads have a large pitch (e.g., 1000 μm) suitable for interfacing to an interposer or PCB socket, while the gap between the stubs is small (e.g., 15 μm), as limited only by the minimum spacing allowed for metal features on the opposite side of the package employed for interfacing to the IC.
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Citations
20 Claims
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1. An integrated circuit (IC) package substrate, comprising:
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a first conductive vertical transition passing through a thickness of the substrate beginning at a first top-side metal feature on a first substrate side and ending at a first bottom-side metal feature on a second substrate side, opposite the first side; and a second conductive vertical transition passing through the substrate thickness beginning at a second top-side metal feature on the first substrate side and ending at a second bottom-side metal feature on the second substrate side, wherein the perimeters of first and second bottom-side metal features include complementary capacitive coupling stubs. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 13, 14, 15, 16)
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11. An integrated circuit (IC) package substrate, comprising:
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a plurality of signal lines adjacent to one another and extending through a thickness of the substrate; and one or more ground line adjacent to at least one of the plurality of signal lines and extending through the thickness of the substrate;
wherein each of the plurality of signal lines terminate at surface pads that include capacitive coupling stubs interdigitated with stubs of at least one other adjacent pad, and wherein the ground line terminates at a surface pad that has no capacitive coupling stubs. - View Dependent Claims (12)
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17. A computer system comprising:
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an integrated circuit (IC) chip comprising at least one logic processor core; a package substrate; and an interposer or printed circuit board (PCB), wherein the package substrate comprises; a first conductive vertical transition passing through a thickness of the substrate beginning at a first top-side metal feature connected to the IC chip and ending at a first bottom-side metal feature connected to the interposer or PCB; and a second conductive vertical transition passing through the substrate thickness beginning at a second top-side metal feature connected to the IC chip and ending at a second bottom-side metal feature connected to the interposer or PCB, wherein the perimeters of first and second bottom-side metal features include capacitive coupling stubs. - View Dependent Claims (18, 19, 20)
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Specification