CASE, METHOD OF MANUFACTURING CASE, AND ELECTRONIC DEVICE
First Claim
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1. An electronic device comprising:
- an outer housing forming an external appearance of the electronic device,wherein a portion of the outer housing comprises;
an injection preform having a surface with a pattern, the pattern formed by a plurality of recesses formed on the surface;
a deposition layer deposited on the injection preform, and having a first surface directly contacting the surface of the injection preform, and a second surface facing an opposite direction of the first surface; and
a paint layer formed on the second surface of the deposition layer, andwherein the second surface of the deposition layer has a curve substantially identical to the surface of the injection preform.
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Abstract
A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a surface of the injection preform, and forming a paint layer on the deposition layer.
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Citations
24 Claims
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1. An electronic device comprising:
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an outer housing forming an external appearance of the electronic device, wherein a portion of the outer housing comprises; an injection preform having a surface with a pattern, the pattern formed by a plurality of recesses formed on the surface; a deposition layer deposited on the injection preform, and having a first surface directly contacting the surface of the injection preform, and a second surface facing an opposite direction of the first surface; and a paint layer formed on the second surface of the deposition layer, and wherein the second surface of the deposition layer has a curve substantially identical to the surface of the injection preform. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A case for an electronic device, comprising:
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an injection preform having a uniform thickness, partially having a rib on an inner surface thereof, and having a recess on an outer surface thereof; a deposition layer formed of a non-conductive metallic material deposited on a surface of the injection preform; and a paint layer formed on the deposition layer, wherein a thickness of the rib is set to 50% or less of a thickness of the injection preform, and the deposition layer is provided to directly contact a surface of the injection preform to express a texture of the recess.
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14. A case for an electronic device, comprising:
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a front surface case; and at least one case coupled to a rear surface of the front surface case, wherein at least one of the front surface case and the case comprises; an injection preform forming a recess on a surface thereof; a deposition layer deposited on a surface of the injection preform; and a paint layer formed on the deposition layer, and wherein the deposition layer directly contacts a surface of the injection preform. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for manufacturing a case for an electronic device, the method comprising:
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forming an injection preform having a surface with a pattern formed on at least one port ion of a surface of the case, the pattern formed by a plurality of recesses formed on the surface; plasma-processing a surface of the injection preform; forming a deposition layer on the surface of the plasma-processed injection preform, wherein the deposition layer deposited on a surface of the injection preform has a first surface directly contacting a surface of the injection preform and surfaces of the recesses, and a second surface facing an opposite direction of the first surface; and forming a paint layer on the deposition layer. - View Dependent Claims (24)
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Specification