Electronic Device With Heat Dissipating Electromagnetic Interference Shielding Structures
First Claim
1. Apparatus, comprising:
- a first printed circuit;
at least a first electrical component mounted on the first printed circuit;
a metal electromagnetic interference shielding enclosure having a bottom wall and vertical sidewalls that form an interior cavity in which the first electrical component and the first printed circuit are mounted;
a second printed circuit; and
at least a second electrical component mounted on the second printed circuit, wherein the second electrical component is adjacent to the bottom wall so that heat from the second electrical component dissipates through the metal electromagnetic shielding enclosure.
1 Assignment
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Accused Products
Abstract
An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.
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Citations
23 Claims
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1. Apparatus, comprising:
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a first printed circuit; at least a first electrical component mounted on the first printed circuit; a metal electromagnetic interference shielding enclosure having a bottom wall and vertical sidewalls that form an interior cavity in which the first electrical component and the first printed circuit are mounted; a second printed circuit; and at least a second electrical component mounted on the second printed circuit, wherein the second electrical component is adjacent to the bottom wall so that heat from the second electrical component dissipates through the metal electromagnetic shielding enclosure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. An electronic device, comprising:
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a plastic housing; internal structures mounted in the plastic housing, wherein the internal structures include a power supply enclosed within a metal shielding enclosure having a bottom wall, vertical sidewalls, and a lid; a printed circuit board on which an integrated circuit is mounted; and thermally conductive structures between the integrated circuit and the bottom wall that convey heat from the integrated circuit to the metal shielding enclosure. - View Dependent Claims (19, 20)
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21. Apparatus, comprising:
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a metal electromagnetic signal shielding enclosure having a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that encloses an interior cavity; power supply circuitry in the interior cavity; an integrated circuit; a metal plate that dissipates heat from the integrated circuit; and a printed circuit board on which the integrated circuit is mounted, wherein the printed circuit board has an upper surface that faces the bottom wall and has an opposing lower surface that faces the metal plate. - View Dependent Claims (22, 23)
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Specification