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Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices

  • US 20140268604A1
  • Filed: 03/14/2013
  • Published: 09/18/2014
  • Est. Priority Date: 03/14/2013
  • Status: Active Grant
First Claim
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1. A method of embedding a filament in a three-dimensional structure, structural component or 3D structural electronic, electromagnetic or electromechanical component/device comprising the steps of:

  • providing at least a first layer of a substrate material; and

    embedding at least a portion of a filament within the first layer of the substrate material such that the portion of the filament is substantially flush with a top surface of the first layer and a portion of the substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer.

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