Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices

• US 20140268604A1
• Filed: 03/14/2013
• Published: 09/18/2014
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Wicker, Ryan B., Medina, Francisco, MacDonald, Eric, Muse, Danny W., Espalin, David
• Granted Patent: US 10,518,490 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: B29C 64/321 Feeding
• CPC Class Codes: B29C 70/681 Component parts, details or accessories; Auxiliary operations
• CPC Class Codes: B29C 70/82 Forcing wires, nets or the like partially or completely into the surface of an article, e.g. by cutting and pressing
• CPC Class Codes: B29C 70/885 with incorporated metallic wires, nets, films or plates as lost heating elements B29C35/0272, B29C61/0625
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2203/0285 Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 3/103 by bonding or embedding conductive wires or strips
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49172 by molding of insulating material

Abstract

The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Claims

1. A method of embedding a filament in a three-dimensional structure, structural component or 3D structural electronic, electromagnetic or electromechanical component/device comprising the steps of:

providing at least a first layer of a substrate material; and

embedding at least a portion of a filament within the first layer of the substrate material such that the portion of the filament is substantially flush with a top surface of the first layer and a portion of the substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer.

2. The method as recited in claim 1, further comprising the step of depositing at least a second layer of the substrate material on the first layer such that all or part of the portion of the filament is covered by the second layer.

3. The method as recited in claim 1, wherein the first layer and the second layer comprise a first design layer and a second design layer, and each design layer comprises one or more additive process layers.

4. The method as recited in claim 1, further comprising:

the step of creating one or more geometrical allowances within the top surface of the first layer, wherein the geometrical allowances reduce a volume of the portion of the substrate material in the flowable state to be displaced and increase a surface area in contact with the portion of the filament prior to embedding the filament, therefore reducing an energy required for sufficient embedding;

the portion of the filament is subsequently embedded within the one or more geometrical allowances;

the one or more geometrical allowances comprise one or more trenches, one or more channels or one or more cavities; and

the one or more geometrical allowances have cross sections that are circular shaped, square shaped, rectangular shaped or triangular shaped.

5. The method as recited in claim 1, wherein the portion of the filament is embedded within the first layer using a wire-feed and cutting system, and at least one energy source for embedding the filament or filament mesh selected from the group comprising:

an ultrasonic horn or sonotrode for generating frictional heat between at least a portion of the filament or filament mesh and the substrate;

an induction heating coil for inducing eddy currents and thereby Joule heat within at least a portion of the filament or filament mesh;

one or more resistive heating elements for generating and transferring heat by conduction to at least a portion of the filament or filament mesh;

electrodes for passing electrical current through at least a portion of the filament or filament mesh and thereby generating Joule heat within the filament or filament mesh;

an air heating and circulating device or system to transfer heat to at least a portion of the filament or filament mesh by forced convection heating; and

a radiant infrared heat source to transfer heat radiatively to at least a portion of the filament or filament mesh.

6. The method as recited in claim 1, wherein the first layer further comprises at least a first component or conductor disposed on or within the first layer, the filament comprises a conductive material, a first end of the filament is proximate to the first component or conductor, and further comprising the step of attaching the first end of the filament to the first component or conductor.

7. The method as recited in claim 6, wherein the first end of the filament is attached to the first component or conductor using a laser micro-welding process, a wire bonding process, resistance welding process, an ultrasonic welding process, or a solder process.

8. The method as recited in claim 6, wherein the first layer further comprises at least a second component or conductor disposed on or within the first layer, a second end of the filament is proximate to the second component or conductor, and further comprising the step of attaching the second end of the filament to the second component or conductor.

9. The method as recited in claim 1, wherein the filament comprises a conductive material, a non-conductive material, an optical fiber or a mesh.

10. The method as recited in claim 9, wherein:

the conductive material comprises a metal, a metal alloy, a conductive polymer or a wire;

the non-conductive material comprises one or more carbon fibers or one or more Kevlar fibers;

the mesh comprises a conductive mesh or a non-conductive mesh;

the conductive mesh comprises a set of filaments made of a metal, a metal alloy, a conductive polymer or a wire; and

the non-conductive mesh comprises a set of carbon fibers or Kevlar fibers.

11. The method as recited in claim 9, wherein the mesh comprises a heat sink, an antenna, a conductive plane, a mechanical reinforcement, or an electromagnetic shield.

12. The method as recited in claim 9, wherein the filament or the mesh improves a physical characteristic, a thermal characteristic, or an electrical characteristic of the first layer, or the three-dimensional electronic, electromagnetic or electromechanical component/device.

13. The method as recited in claim 1, wherein the substrate material comprises a thermoplastic material or a thermoplastic material which is filled with another polymer material, a ceramic material, a metallic material, a mineral material, a glass ceramic material, a semi-conductor material, a nanomaterial, a biomaterial, an organic material, an inorganic material or any combination thereof to enhance the physical, mechanical, thermal, dielectric, magnetic, or electromagnetic properties of the substrate.

14. The method as recited in claim 1, wherein the one or more layers are deposited using a fused deposition modeling (FDM) process or other extrusion-based additive manufacturing processes, a selective laser sintering (SLS) process or powder bed fusion additive manufacturing process, a laminated object manufacturing (LOM) process or sheet lamination additive manufacturing process utilizing thermoplastic sheets, a stereolithography process or vat photopolymerization additive manufacturing process utilizing photocurable thermoplastics, a material jetting process utilizing photocurable thermoplastics, or other additive thermoplastic-based 3D printing processes.

15. A three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device made by a method comprising the steps of (a) providing at least a first layer of a substrate material, and (b) embedding at least a portion of a filament within the first layer of the substrate material such that the portion of the filament is substantially flush with a top surface of the first layer and a portion of the substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer.

16. A system for making a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device comprising:

a three-dimensional printing device that creates one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion; and

a first machine that embeds at least a portion of a filament within a first layer of the substrate material such that the portion of the filament is substantially flush with a top surface of the first layer and a portion of the substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer.

17. The system as recited in claim 16, wherein:

the three-dimensional printing device comprises a fused deposition modeling (FDM) machine or other extrusion-based additive manufacturing machine, a selective laser sintering (SLS) machine or other powder bed fusion additive manufacturing process, a laminated object manufacturing (LOM) machine or other sheet lamination additive manufacturing process utilizing thermoplastic sheets, a stereolithography machine or other vat photopolymerization additive manufacturing process utilizing photocurable thermoplastics, a material jetting machine utilizing photocurable thermoplastics, or other additive thermoplastic-based 3D printing machine; and

the first machine comprises a wire-feed and cutting system, and at least one energy source for embedding the filament or filament mesh selected from the group comprising;

an ultrasonic horn or sonotrode for generating frictional heat between at least a portion of the filament or filament mesh and the substrate,

an induction heating coil for inducing eddy currents and thereby Joule heat within at least a portion of the filament or filament mesh,

one or more resistive heating elements for generating and transferring heat by conduction to at least a portion of the filament or filament mesh,

electrodes for passing electrical current through at least a portion of the filament or filament mesh and thereby generating Joule heat within the filament or filament mesh,

an air heating and circulating device or system to transfer heat to at least a portion of the filament or filament mesh by forced convection heating, and

a radiant infrared heat source to transfer heat radiatively to at least a portion of the filament or filament mesh.

18. The system as recited in claim 16, wherein the three-dimensional printing device further deposits at least a second layer of the substrate material on the first layer such that all or part of the portion of the filament is covered by the second layer.

19. The system as recited in claim 16, further comprising:

a component placement machine that places a first component on or within the first layer;

the filament comprises a conductive material;

a first end of the filament is proximate to the first component; and

a third machine that attaches the first end of the filament to the first component.

20. The system as recited in claim 19, wherein the third machine comprises a laser micro-welding machine, a resistance welding machine, an ultrasonic welding machine, a wire bonding machine, or a solder machine.