METHOD FOR FABRICATING STACK DIE PACKAGE
First Claim
Patent Images
1. A method comprising:
- coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface; and
coupling a source of a second die to said drain of said first die, said second die comprising a gate and a drain that are located on a first surface of said second die and said source that is located on a second surface of said second die that is opposite said first surface.
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Abstract
In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and a drain that are located on a first surface of the second die and the source that is located on a second surface of the second die that is opposite the first surface.
108 Citations
20 Claims
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1. A method comprising:
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coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface; and coupling a source of a second die to said drain of said first die, said second die comprising a gate and a drain that are located on a first surface of said second die and said source that is located on a second surface of said second die that is opposite said first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface; and coupling a source of a second die to said drain of said first die, said second die comprising a gate and said source that are located on a first surface of said second die and said drain that is located on a second surface of said second die that is opposite said first surface. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method comprising:
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coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface; coupling a source of a second die to said drain of said first die, said second die comprising a gate and a drain that are located on a first surface of said second die and said source that is located on a second surface of said second die that is opposite said first surface; and coupling a first clip and a second clip to said second die at approximately the same time. - View Dependent Claims (18, 19, 20)
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Specification