METHODS FOR FORMING LAYERS ON SEMICONDUCTOR SUBSTRATES

• US 20140273518A1
• Filed: 03/11/2014
• Published: 09/18/2014
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: BAUTISTA, KEVIN, ROGERS, MATTHEW S.
• Granted Patent: US 9,217,201 B2
• Time in Patent Office: Days
• US Class Current: 438/776
• CPC Class Codes: C23C 16/045 Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
• CPC Class Codes: C23C 16/452 by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
• CPC Class Codes: C23C 16/45502 Flow conditions in reaction chamber
• CPC Class Codes: C23C 16/4584 the substrate being rotated
• CPC Class Codes: C23C 16/52 Controlling or regulating the coating process C23C16/45557, C23C16/279 take precedence
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/02247 formation by nitridation, e.g. nitridation of the substrate
• CPC Class Codes: H01L 21/02252 formation by plasma treatment, e.g. plasma oxidation of the substrate after treatment of an insulating film by plasma H01L21/3105 and subgroups
• CPC Class Codes: H01L 21/3211 Nitridation of silicon-containing layers

Abstract

Methods of forming a layer on a substrate may include providing a substrate to a process chamber, the process chamber having a gas port, an exhaust, and a plasma port disposed between the gas port and the exhaust; providing a process gas from the gas port in a first direction such that the process gas flows across the substrate; providing a plasma such that a flow of the plasma interacts with a flow of the process gas at an angle that is non-perpendicular; and rotating the substrate while providing the process gas and the plasma, wherein a thickness profile of the layer is controlled by adjusting at least one of a flow velocity of the process gas, a flow velocity of the plasma, the angle the flow of the plasma interacts with the flow of the process gas, or a direction of rotation of the substrate.

Claims

1. A method of forming a layer on a substrate, comprising:

providing a substrate to a substrate support in a process chamber, the process chamber having a gas port disposed on a first side of the substrate support, an exhaust disposed on a second side of the substrate support opposite the first side, and a plasma port disposed between the gas port and the exhaust;

providing a process gas from the gas port in a first direction such that the process gas flows across a surface of the substrate from the gas port to the exhaust;

providing a plasma from the plasma port to the substrate in a second direction that is different from the first direction to form a layer, wherein the plasma is provided such that a flow of the plasma interacts with a flow of the process gas at an angle that is non-perpendicular; and

rotating the substrate in a first direction while providing the process gas and the plasma, wherein a thickness profile of the layer is controlled by adjusting at least one of a flow velocity of the process gas, a flow velocity of the plasma, the angle the flow of the plasma interacts with the flow of the process gas, or a direction of rotation of the substrate.

2. The method of claim 1, further comprising:

exposing the plasma to the substrate for a period of time of about 30 to about 90 seconds to form the layer.

3. The method of claim 1, wherein the process chamber is maintained at a pressure of about 1 to about 20 Torr while forming the layer.

4. The method of claim 1, wherein the process gas is provided at a flow rate of about 1 to about 5 slm and the plasma is provided at a flow rate of about 1 to about 5 slm.

5. The method of claim 1, wherein the process chamber is maintained at a temperature of about 850 to about 1150 degrees Celsius while forming the layer.

6. The method of claim 1, wherein the flow of the plasma is substantially parallel to the surface of the substrate.

7. The method of claim 1, wherein the flow of the plasma is directed towards a top surface of the substrate.

8. The method of claim 7, wherein the thickness profile of the layer may be controlled by adjusting an angle between the flow of the plasma and the top surface of the substrate.

9. The method of claim 1, further comprising:

precleaning a surface of the substrate prior to forming the layer by exposing the substrate to a hydrogen containing plasma.

10. The method of claim 1, wherein the process gas comprises a nitrogen containing gas and the plasma is formed from a nitrogen containing gas, and wherein the layer is a nitrogen containing layer.

11. The method of claim 1, wherein the angle that the flow of the plasma interacts with the flow of the process gas is about 56 to about 71 degrees.

12. A method of forming a layer on a substrate, comprising:

providing a substrate to a substrate support in a process chamber, the process chamber having a gas port disposed on a first side of the substrate support, an exhaust disposed on a second side of the substrate support opposite the first side, and a plasma port disposed between the gas port and the exhaust;

providing a process gas from the gas port in a first direction such that the process gas flows across a surface of the substrate from the gas port to the exhaust, wherein the process gas comprises a nitrogen containing gas;

providing a plasma formed from a nitrogen containing gas from the plasma port to the substrate in a second direction that is different from the first direction to form a nitrogen containing layer, wherein the plasma is provided such that a flow of the plasma interacts with a flow of the process gas at an angle of about 56 to about 71 degrees; and

rotating the substrate in a first direction while providing the process gas and the plasma, wherein a thickness profile of the nitrogen containing layer is controlled by adjusting at least one of a flow velocity of the process gas, a flow velocity of the plasma, the angle the flow of the plasma interacts with the flow of the process gas, or a direction of rotation of the substrate.

13. A computer readable medium having instructions stored thereon that, when executed, cause a method of forming a layer on a substrate disposed on a substrate support in a process chamber having a gas port disposed on a first side of the substrate support, an exhaust disposed on a second side of the substrate support opposite the first side, and a plasma port disposed between the gas port and the exhaust to be performed, the method comprising:

providing a process gas from the gas port in a first direction such that the process gas flows across a surface of the substrate from the gas port to the exhaust;

providing a plasma from the plasma port to the substrate in a second direction that is different from the first direction to form a layer, wherein the plasma is provided such that a flow of the plasma interacts with a flow of the process gas at an angle that is non-perpendicular; and

rotating the substrate in a first direction while providing the process gas and the plasma, wherein a thickness profile of the layer is controlled by adjusting at least one of a flow velocity of the process gas, a flow velocity of the plasma, the angle the flow of the plasma interacts with the flow of the process gas, or a direction of rotation of the substrate.

14. The computer readable medium of claim 13, wherein the angle the flow of the plasma interacts with the flow of the process gas is about 56 to about 71 degrees.

15. The computer readable medium of claim 13, wherein the flow of the plasma is substantially parallel to the surface of the substrate, or wherein the flow of the plasma is directed towards a top surface of the substrate.

16. The computer readable medium of claim 13, further comprising:

precleaning a surface of the substrate prior to forming the layer by exposing the substrate to a hydrogen containing plasma.

17. The computer readable medium of claim 13, wherein the process gas comprises a nitrogen containing gas and the plasma is formed from a nitrogen containing gas, and wherein the layer is a nitrogen containing layer.

18. The computer readable medium of claim 13, wherein the process chamber is maintained at a pressure of about 1 to about 20 Torr and a temperature of about 850 to about 1150 degrees Celsius while forming the layer.

19. The computer readable medium of claim 13, further comprising:

exposing the plasma to the substrate for a period of time of about 30 to about 90 seconds to form the layer.

20. The computer readable medium of claim 13, wherein the process gas is provided at a flow rate of about 1 to about 5 slm and the plasma is provided at a flow rate of about 1 to about 5 slm.