PATTERNED TRANSPARENT CONDUCTORS AND RELATED MANUFACTURING METHODS
First Claim
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1. A patterned transparent conductor comprising:
- a substrate; and
metallic nanowires at least partially embedded into a surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions, wherein the higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.
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Abstract
A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.
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Citations
30 Claims
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1. A patterned transparent conductor comprising:
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a substrate; and metallic nanowires at least partially embedded into a surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions, wherein the higher sheet conductance portions are laterally adjacent to lower sheet conductance portions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A patterned transparent conductor comprising:
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a substrate; a coating disposed over at least one side of the substrate; and metallic nanowires embedded into a surface of the coating according to a pattern to form higher sheet conductance portions, wherein the metallic nanowires are localized within a depth from the surface that is less than a thickness of the coating, and the higher sheet conductance portions are spaced apart by gaps that correspond to lower sheet conductance portions. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
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25. A patterned transparent conductor comprising:
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a substrate; a patterned layer covering an area of the substrate and exposing a laterally adjacent area of the substrate; and additives embedded into a surface of the substrate within the exposed area of the substrate to form a conductive trace, wherein the additives are localized within a depth from the surface that is less than a thickness of the substrate. - View Dependent Claims (26, 27, 28, 29, 30)
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Specification