×

Deposition Method and Deposition Apparatus

  • US 20140287588A1
  • Filed: 04/26/2013
  • Published: 09/25/2014
  • Est. Priority Date: 05/16/2012
  • Status: Abandoned Application
First Claim
Patent Images

1. A deposition method, comprising:

  • etching a natural oxide film in an etching chamber, the natural oxide film being formed on a surface of a silicon substrate;

    transporting the silicon substrate from the etching chamber to a deposition chamber under vacuum;

    cleaning the surface of the silicon substrate in the deposition chamber; and

    causing a film to grow on the cleaned surface of the silicon substrate in the deposition chamber, the film including at least one of silicon and germanium.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×