Integrated Circuit with Antenna for Dielectric Waveguide
First Claim
1. A system comprising an integrated circuit, wherein the integrated circuit comprises:
- a substrate with a top surface and a bottom surface;
semiconductor circuitry formed on the top surface of the substrate, wherein the semiconductor circuitry includes a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal;
a through-substrate via coupled to an interface of the RF amplifier; and
an antenna formed on the bottom surface of the substrate and coupled to the through-substrate via, wherein the antenna is configured to launch or receive an electromagnet wave representative of the RF signal into or from a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
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Abstract
A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal is formed on the top surface of the substrate. A through-substrate via is coupled to an output of the RF amplifier. A metalized antenna formed on the bottom surface of the substrate is coupled to the through-substrate via. The metalized antenna is configured to launch an electromagnet wave representative of the RF signal into a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
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Citations
17 Claims
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1. A system comprising an integrated circuit, wherein the integrated circuit comprises:
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a substrate with a top surface and a bottom surface; semiconductor circuitry formed on the top surface of the substrate, wherein the semiconductor circuitry includes a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal; a through-substrate via coupled to an interface of the RF amplifier; and an antenna formed on the bottom surface of the substrate and coupled to the through-substrate via, wherein the antenna is configured to launch or receive an electromagnet wave representative of the RF signal into or from a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of operating an electronic device, the method comprising:
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generating a sub-terahertz signal in circuitry located on a top surface an integrated circuit within the electronic device; transporting the sub-terahertz signal to an antenna located on a bottom surface of the integrated circuit by one or more through-substrate vias; and radiating a portion of the sub-terahertz signal from the antenna into a dielectric waveguide (DWG). - View Dependent Claims (15, 16, 17)
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Specification