HEAT PIPE STRUCTURE

• US 20140290914A1
• Filed: 03/23/2014
• Published: 10/02/2014
• Est. Priority Date: 03/26/2013
• Status: Abandoned Application

• Current Assignee: ASUSTek Computer, Inc.
• Original Assignee: ASUSTek Computer, Inc.
• Inventors: CHIOU, Ing-Jer, WANG, Cheng-Yu
• Application Number:
  US14/222,676
• Publication Number:
  US 20140290914A1
• Time in Patent Office: Days
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat pipe structure includes a hollow tube body and a plurality of capillary structures. A first region and a second region are defined in the hollow tube body. The capillary structure is disposed on the first region. A diameter of the second region is larger than a diameter of the first region.

Claims

1. A heat pipe structure, comprising

a hollow tube body, defining a first region and a second region;

and

a plurality of capillary structures disposed on the first region, wherein the diameter of the second region is larger than the diameter of the first region.

2. The heat pipe structure according to claim 1, wherein the first region includes a first surface and a second surface, and the capillary structure is divided into a first part and a second part.

3. The heat pipe structure according to claim 2, wherein the first part contacts the first surface.

4. The heat pipe structure according to claim 3, wherein the first part is connected to the second part.

5. The heat pipe structure according to claim 1, wherein the second region is divided into at least two subspaces.

6. The heat pipe structure according to claim 5, wherein the diameter of each of the subspaces is equal or not equal to that of the first region.

7. The heat pipe structure according to claim 5, wherein the diameters of the subspaces are equal or not equal.

8. The heat pipe structure according to claim 1, wherein the capillary structure is metal sinters, micro grooves, fibers, mental nets or the combinations thereof.