COVER FOR A MEMS MICROPHONE

• US 20140291783A1
• Filed: 03/20/2014
• Published: 10/02/2014
• Est. Priority Date: 03/21/2013
• Status: Abandoned Application

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Friel, Kurt, Talag, Dennis, Lim, Tony
• Application Number:
  US14/220,614
• Publication Number:
  US 20140291783A1
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A microphone assembly includes a base, a cover, and a microelectromechanical system (MEMS) die. The cover extends at least partially over and is coupled to the base. The cover and the base form a cavity. The MEMS die is coupled to the base and disposed within the cavity. At least a portion of the cover is constructed of a copper-nickel-zinc alloy that is effective in preventing solder from moving from a first portion of the cover to a second portion of the cover.

Claims

1. A microphone assembly, the assembly comprising:

a base;

a cover extending at least partially over and coupled to the base, the cover and the base forming a cavity;

a microelectromechanical system (MEMS) die coupled to the base and disposed within the cavity;

wherein at least a portion of the cover is constructed of a copper-nickel-zinc alloy that is effective in preventing solder from moving from a first portion of the cover to a second portion of the cover.

2. The assembly of claim 1, wherein the copper-nickel-zinc alloy covers the entire cover.

3. The assembly of claim 1, wherein the copper-nickel-zinc alloy covers approximately half of the cover nearest to the base.

4. The assembly of claim 3, wherein the remaining portion of the cover is constructed of brass.

5. The assembly of claim 1, wherein the cover comprises a lip in proximity to the base and the lip is constructed of the copper-nickel-zinc alloy.

6. The assembly of claim 1, wherein the copper-nickel-zinc alloy has a composition that is approximately 55 percent copper, approximately 18 percent nickel, and approximately 27 percent zinc.

7. The assembly of claim 1, wherein a port extends through the base.

8. The assembly of claim 1, wherein a port extends through the cover.