MEMS APPARATUS WITH INCREASED BACK VOLUME

• US 20140291784A1
• Filed: 03/20/2014
• Published: 10/02/2014
• Est. Priority Date: 03/28/2013
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Conklin, Wade
• Granted Patent: US 9,467,785 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/2807 Enclosures comprising vibrating or resonating arrangements for the reduction of undesired resonances or vibrations H04R1/2869
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A microelectromechanical system (MEMS) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity. The base forms a recess and the recess has dimensions and a shape so as to hold a MEMS die. The MEMS die includes a diaphragm and back plate.

Claims

1. A microelectromechanical system (MEMS) microphone assembly, comprising

a base;

a cover, the cover being coupled to the base and together with the base defining a cavity;

wherein the base forms a recess, the recess having dimensions and a shape so as to hold a MEMS die, the MEMS die including a diaphragm and back plate.

2. The MEMS microphone assembly of claim 1 wherein the recess also holds an integrated circuit, the integrated circuit electrically coupled to the MEMS die.

3. The MEMS microphone assembly of claim 1 wherein the base comprises a multi-layer printed circuit board.

4. The MEMS microphone assembly of claim 1 wherein a port extends through the base and communicates with portions of the MEMS die.

5. The MEMS microphone assembly of claim 1 wherein the base defines a top surface and the MEMS die extends above the top surface and into the cavity.

6. The MEMS microphone assembly of claim 1, where the base defines a top surface and the MEMS die extends below the top surface and into the cavity.