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Method Apparatus and Material for Radio Frequency Passives and Antennas

  • US 20140293529A1
  • Filed: 03/29/2013
  • Published: 10/02/2014
  • Est. Priority Date: 03/29/2013
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a substrate configured for electrical connection to a system board;

    a synthesized magnetic layer connected to the substrate; and

    an antenna over the magnetic layer.

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