Method Apparatus and Material for Radio Frequency Passives and Antennas

• US 20140293529A1
• Filed: 03/29/2013
• Published: 10/02/2014
• Est. Priority Date: 03/29/2013
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Nair, Vijay K., Hu, Chuan, Liff, Shawna M., Mosley, Larry E.
• Granted Patent: US 9,461,355 B2
• Time in Patent Office: Days
• US Class Current: 361/679.31
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: H01F 1/0054 Coated nanoparticles, e.g. nanoparticles coated with organic surfactant
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2223/6672 for integrated passive components, e.g. semiconductor device with passive components only
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24195 the item being a discrete passive component
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/05442 : SiO2
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1421 : RF devices
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/186 : Material
• CPC Class Codes: H01L 2924/19011 : including integrated passive components
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19102 : in a stacked assembly with the semiconductor or solid state device
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/2291 : used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN] H01Q1/241 takes precedence; WLAN in general H04W
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/06 : with core of ferromagnetic material H01Q7/02 takes precedence

Abstract

A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.

Claims

1. A semiconductor package comprising:

a substrate configured for electrical connection to a system board;

a synthesized magnetic layer connected to the substrate; and

an antenna over the magnetic layer.

2. The package of claim 1, further comprising a semiconductor circuit die and wherein the antenna is coupled to the die with vias that extend through the magnetic layer.

3. The package of claim 2, wherein the die is connected to the substrate opposite the antenna and wherein the antenna is coupled to the circuit by vias formed in the substrate.

4. The package of claim 1, 2, or 3, further comprising a package cover and wherein the magnetic layer is screen printed over the package cover.

5. The package of claim 4, wherein the package cover is formed of a molding compound.

6. The package of any one or more of the above claims, further comprising a package cover and wherein the magnetic layer is on the substrate and the package cover is formed over the substrate, the magnetic layer and the antenna.

7. The package of any one or more of the above claims, wherein the antenna is formed of copper plating.

8. The package of any one or more of the above claims, wherein the magnetic layer is formed of magnetic nanoparticles cured in an epoxy resin.

9. The package of claim 8, wherein the nanoparticles are aligned using a magnetic field while being cured.

10. The package of claim 8, wherein the magnetic nanoparticles comprise passivated silane coated silica particles.

11. The package of any one or more of the above claims, wherein the magnetic layer comprises a polymeric binder.

12. An electronic component comprising:

a synthesized magnetic nanocomposite material with aligned magnetic domains;

a conductor embedded within the nanocomposite material; and

contact pads extending through the nanocomposite material to connect to the conductor.

13. The electronic component of claim 12, wherein the conductor is a copper strip, and wherein the contact pads are each at opposite ends of the strip to form an inductor.

14. The electronic component of claim 13, wherein the copper strip is linear to form a single turn inductor.

15. The electronic component of claim 12, 13, or, 14, further comprising a substrate to carry the nanocomposite material and the conductor and dielectric walls to isolate and contain the nanocomposite material.

16. A method comprising:

applying a magnetic nanocomposite material to a package having a substrate, the nanocomposite material having magnetic nanoparticles in an epoxy resin;

aligning the magnetic fields of the magnetic nanoparticles;

curing the resin to maintain the alignment of the magnetic nanoparticles;

applying conductive paths to the nanocomposite material; and

forming connectors to the conductive paths to complete an electronic device.

17. The method of claim 16, wherein the conductive path is a single turn inductor coil.

18. The method of claim 16 or 17, wherein aligning the magnetic fields comprises heating the epoxy resin, applying a magnetic field, and allowing the resin to cure with the magnetic field applied.

19. The method of claim 16, 17, or 18, wherein the magnetic nanoparticles are passivated and silica coated.

20. The method of claim 19, wherein the magnetic nanoparticles are surface treated with a silane compound.

21. The method of claim 20, wherein the resin is an organic heat cured resin.

22. The method of any one or more of claims 16-21, further comprising forming antennas on the nanocomposite material and connecting the antennas to the connectors.

23. The method of any one or more of claims 16-22, further comprising forming a cover over the substrate, wherein applying the nanocomposite material comprises applying the material over the cover, and wherein forming the antennas comprises forming the antennas over the nanocomposite material.

24. A synthesized magnetic nanocomposite material comprising:

a plurality of magnetic nanoparticles; and

an organic heat cured resin.

25. The material of claim 24, wherein the magnetic nanoparticles are passivated and silica coated.

26. The material of claim 24 or 25, wherein the magnetic nanoparticles are surface treated with a silane compound.

27. The material of any one or more of claims 24-26, wherein the magnetic particles fill the resin in excess of 80 volume percent.

28. The material of any one or more of claims 24-27, wherein the magnetic particles have a variety of different sizes within a range of between 50 nm and 20 nm.

29. The package of any one or more of claims 24-28, wherein the magnetic particles are aligned using a magnetic field while being cured.

30. The package of any one or more of claims 24-29, wherein the magnetic particles comprise passivated silane coated silica particles.

31. The package of any one or more of claims 24-30, wherein the resin comprises a polymeric binder.

32. A computing device comprising:

a system board having a main processor coupled to the system board;

a package having a package substrate coupled to the system board and an antenna, the antenna being formed over a synthesized magnetic layer connected to the substrate.

33. The computing device of claim 32, wherein the package further comprises a semiconductor circuit die and wherein the antenna is coupled to the die with vias that extend through the magnetic layer.

34. The computing device of claim 32 or 33, the package further comprising a package cover and wherein the magnetic layer is screen printed over the package cover.

35. The computing device of any one or more of claims 32-34, wherein the magnetic layer is on the substrate of the package, the package further comprising a package cover formed over the substrate, the magnetic layer and the antenna.

36. The computing device of any one or more of claims 32-35, wherein the antenna is formed of copper plating.

37. The computing device of any one or more of claims 32-36, wherein the magnetic layer is formed of magnetic nanoparticles cured in an epoxy resin that are aligned using a magnetic field while being cured.