Method Apparatus and Material for Radio Frequency Passives and Antennas
First Claim
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1. A semiconductor package comprising:
- a substrate configured for electrical connection to a system board;
a synthesized magnetic layer connected to the substrate; and
an antenna over the magnetic layer.
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Abstract
A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.
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Citations
37 Claims
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1. A semiconductor package comprising:
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a substrate configured for electrical connection to a system board; a synthesized magnetic layer connected to the substrate; and an antenna over the magnetic layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic component comprising:
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a synthesized magnetic nanocomposite material with aligned magnetic domains; a conductor embedded within the nanocomposite material; and contact pads extending through the nanocomposite material to connect to the conductor. - View Dependent Claims (13, 14, 15)
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16. A method comprising:
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applying a magnetic nanocomposite material to a package having a substrate, the nanocomposite material having magnetic nanoparticles in an epoxy resin; aligning the magnetic fields of the magnetic nanoparticles; curing the resin to maintain the alignment of the magnetic nanoparticles; applying conductive paths to the nanocomposite material; and forming connectors to the conductive paths to complete an electronic device. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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24. A synthesized magnetic nanocomposite material comprising:
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a plurality of magnetic nanoparticles; and an organic heat cured resin. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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32. A computing device comprising:
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a system board having a main processor coupled to the system board; a package having a package substrate coupled to the system board and an antenna, the antenna being formed over a synthesized magnetic layer connected to the substrate. - View Dependent Claims (33, 34, 35, 36, 37)
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Specification