FORCED AIR COOLING-TYPE POWER CONVERSION DEVICE

• US 20140301041A1
• Filed: 11/30/2011
• Published: 10/09/2014
• Est. Priority Date: 11/30/2011
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Kitanaka, Hidetoshi
• Granted Patent: US 9,240,750 B2
• Time in Patent Office: Days
• US Class Current: 361/697
• CPC Class Codes: H02M 1/088 for the simultaneous control of series or parallel connected semiconductor devices
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/487 Neutral point clamped inverters
• CPC Class Codes: H02P 29/68 based on the temperature of a drive component or a semiconductor component
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

Power conversion sub-blocks are combined to be configured as a power conversion block. The power conversion sub-blocks include power conversion modules including cooler base sections on which semiconductor elements are mounted and cooler fin sections provided on the rear surface side of semiconductor element mounting surfaces in the cooler base sections and cooler attachment members to which cooler fin sections are attached back to back, the cooler attachment members being configured to be capable of separating an opened section where the cooler fin sections are present and external air circulates and a closed section where the semiconductor elements are present and circulating cooling air to the cooler fin sections.

Claims

1. A forced air cooling-type power conversion device including power conversion circuits equipped with a plurality of semiconductor elements and a capacitor that stores direct-current power supply, the forced air cooling-type power conversion device converting electric power input from a power supply into an arbitrary value and outputting the electric power to a motor,

the forced air cooling-type power conversion device comprising:

power conversion modules each including;

a part of the semiconductor elements configuring the power conversion circuit;

a cooler base section on which the semiconductor elements are mounted; and

a cooler fin section provided on a rear surface side of the semiconductor element mounting surface in the cooler base section; and

power conversion sub-blocks each including;

a cooler attachment member to which the cooler fin sections in at least a pair of the power conversion modules are attached to face each other; and

conductor plates connected to the semiconductor elements, wherein

a plurality of the power conversion sub-blocks configure a power conversion block with a plurality of the conductor plates arranged perpendicularly to a connection conductor plate arranged in parallel to the bottom surface of the forced air cooling-type power conversion device,

a plurality of the cooler fin sections arranged on an inner side of the cooler attachment member are collectively cooled by cooling air, and

the power conversion block is connected to the capacitor and another power conversion block by the connection conductor plate.

2. The forced air cooling-type power conversion device according to claim 1, comprising:

a cooling fan; and

an air guide member that couples the cooling fan and the cooler attachment member,

the forced air cooling-type power conversion device being configured to circulate, with the air guide member, the cooling air to the opened section of the cooler attachment member, wherein

a seal member is arranged on at least one of the cooler attachment member side of the air guide member and the air guide member side of the cooler attachment member, and at least the power conversion module is configured to be capable of being drawn out to outside of the device so as to be attached and detached.

3. The forced air cooling-type power conversion device according to claim 1, comprising:

a cooling fan; and

an air guide member that couples the cooling fan and the cooler attachment member,

the forced air cooling-type power conversion device being configured to blow, with the air guide member, the cooling air to the opened section of the cooler attachment member, wherein

a seal member is arranged on at least one of the cooling fan side of the air guide member and the air guide member side of the cooler fan, and at least the power conversion modules are configured to be capable of being drawn out to outside of the device so as to be attached and detached.

5. The forced air cooling-type power conversion device according to claim 1, wherein

the connection conductor plate is arranged in the closed section on an upper side or a lower side of the power conversion block and arranged in a direction in which a length direction thereof is orthogonal to a direction of the cooling air.

4. (canceled)

6. A forced air cooling-type power conversion device including a plurality of semiconductor elements, the forced air cooling-type power conversion device converting electric power input from a power supply into an arbitrary value and outputting the electric power to a motor, the forced air cooling-type power conversion device comprising:

power conversion modules each including;

the semiconductor elements;

a cooler base section on which the semiconductor elements are mounted; and

a cooler fin section provided on a rear surface side of the semiconductor element mounting surface in the cooler base section;

power conversion sub-blocks each including at least a pair of the power conversion modules;

a power conversion block obtained by connecting a plurality of the power the power conversion block;

a capacitor that stores direct-current power; and

a capacitor conductor plate connected to the capacitor, wherein

the capacitor conductor plate and the connection conductor plate of the power conversion block are configured to be capable of being connected to and disconnected from each other by a conductor connection member,

conductor plates connected to the plurality of semiconductor elements are arranged perpendicularly to the connection conductor plate arranged in parallel to a bottom surface of the power conversion device, and one end portion of the connection conductor plate of the power conversion block is configured to be connectable to a connection conductor plate of another power conversion block via the capacitor, and

the power conversion block is configured to be capable of being drawn out to an outside of the device and attached and detached.

7. The forced air cooling-type power conversion device according to claim 6, wherein the connection conductor plate and the capacitor conductor plate are arranged horizontally along a device floor surface and include an opened section and a cover on a device lower surface to enable the conductor connection member to be attached and detached.