LED LIGHTING SYSTEM, METHOD, AND APPARATUS

• US 20140301074A1
• Filed: 03/06/2014
• Published: 10/09/2014
• Est. Priority Date: 03/06/2013
• Status: Abandoned Application

• Current Assignee: Lynk Labs, Inc.
• Original Assignee: Lynk Labs, Inc.
• Inventors: Miskin, Michael
• Application Number:
  US14/199,328
• Publication Number:
  US 20140301074A1
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: E04B 9/32 Translucent ceilings, i.e. permitting both the transmission and diffusion of light E04B9/303 and E04B9/34 takes precedence; lighting F21
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21S 8/04 intended only for mounting on a ceiling or the like overhead structures F21S8/02 takes precedence; details of ceiling bases F21V21/03
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21V 33/006 General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
• CPC Class Codes: F21Y 2105/00 Planar light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An LED lighting system having at least one LED circuit formed on a PCB assembly, the LED circuit and the PCB assembly forming an LED PCB assembly, and a driver for powering the LED circuit. The LED lighting system includes a cover for attaching to the LED PCB assembly, the cover being configured to allow light emitting from the LED PCB assembly to pass there through.

Claims

1. An LED lighting system comprising:

at least one LED circuit formed on a PCB assembly, the LED circuit and the PCB assembly forming an LED PCB assembly;

a driver for powering the LED circuit;

a cover for attaching to the LED PCB assembly, the cover being configured to allow light emitting from the LED PCB assembly to pass there through,

wherein the LED PCB assembly, the driver, and the cover are configured to form a ceiling tile.

2. The LED lighting system of claim 1 further comprising at least one sheet of thermal conductive material, the LED PCB assembly being mounted to the at least one sheet of thermal conductive material.

3. The LED lighting system of claim 1 wherein the LED PCB assembly is a chip on board LED package.

4. The LED lighting system of claim 1 further comprising at least one remote phosphor mounted over at least one LED forming the at least one LED circuit.

5. The LED lighting system of claim 1 wherein the driver is formed as part of the LED PCB assembly.

6. The LED lighting system of claim of claim 1 wherein the driver is packaged separately from the LED PCB assembly.

7. The LED lighting system of claim 1 further comprising a lens mounted over at least one LED forming the at least one LED circuit.

8. The LED lighting system of claim 1 wherein the PCB assembly is constructed using FR4 material.

9. The LED lighting system of claim 1 wherein the PCB assembly is constructed using a flexible PCB.

10. The LED lighting system of claim 1 wherein the PCB assembly is constructed using metal core PCB.

12. The LED lighting system of claim 1 further comprising an optical film mounted over at least one LED forming the at least one LED circuit.

11. The LED lighting system of claim I further comprising an optical diffuser mounted over at least one LED forming the at least one LED circuit.

13. A ceiling tile comprising:

at least one LED circuit formed on a PCB assembly, the LED circuit and the PCB assembly forming an LED PCB assembly;

a driver for powering the LED circuit; and

a cover for attaching to the LED PCB assembly, the cover being configured to allow light emitting from the LED PCB assembly to pass there through.

14. The ceiling tile of claim 13 further comprising at least one sheet of thermal conductive material, the PCB assembly being mounted to the at least one sheet of thermal conductive material.

15. The ceiling tile of claim 13 wherein the LED PCB assembly is a chip on board type LED package.

16. The ceiling tile of claim 13 further comprising at least one remote phosphor mounted over at least LED forming the at least one LED circuit.

17. The ceiling tile of claim 13 wherein the driver is formed as part of the LED PCB assembly.

18. The ceiling tile of claim of claim 13 wherein the driver is packaged separately from the LED PCB assembly.

19. The ceiling tile of claim 13 further comprising a lens mounted over the at least one LED forming the at least one LED circuit.

20. The ceiling tile of claim 13 wherein the PCB assembly is constructed using FR4 material.

21. The ceiling tile of claim 13 wherein the PCB assembly is constructed using a flexible PCB.

22. The ceiling tile of claim 13 wherein the at least one LED PCB assembly is constructed using metal core PCB.

23. The ceiling tile of claim 13 further comprising an optical diffuser mounted over at least one LED forming the at least one LED circuit

24. The ceiling tile of claim 13 further comprising an optical film mounted over at least one LED forming the at least one LED circuit