CAPACITIVE SENSOR INTEGRATED IN AN INTEGRATED CIRCUIT PACKAGE

• US 20140304826A1
• Filed: 04/08/2014
• Published: 10/09/2014
• Est. Priority Date: 04/08/2013
• Status: Active Grant

• Current Assignee: Cirque Corporation
• Original Assignee: Cirque Corporation
• Inventors: Bytheway, Jared G., Peterson, Steven C.
• Granted Patent: US 9,619,675 B2
• Time in Patent Office: Days
• US Class Current: 726/26
• CPC Class Codes: G06F 21/755 with measures against power attack
• CPC Class Codes: G06F 21/86 Secure or tamper-resistant housings
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate

Abstract

A system and method for disposing a capacitive proximity and touch sensor in locations where an integrated circuit package may be vulnerable to intrusion by providing electrodes in the packaging that may prevent interception of data obtained by a probe that is brought into proximity of the integrated circuit.

Claims

1. A method for determining if data is being intercepted from a protected integrated circuit package, said method comprising:

1) providing at least one integrated circuit in an encapsulant, a first proximity and touch sensor disposed on a face of the at least one integrated circuit in a redistribution layer, a redistribution layer disposed on a back of the at least one integrated circuit, at least one via from the redistribution layer on the face to the redistribution layer on the back, and a plurality of connectors from outside the protected integrated circuit package to the redistribution layer on the back;

2) making a baseline measurement of an environment around the protected integrated circuit package;

3) recording the baseline measurement;

4) making subsequent periodic measurements;

5) comparing the baseline measurement and the subsequent periodic measurements to determine if there are changes in capacitance around the protected integrated circuit package; and

6) performing an action if there are changes in capacitance that indicate that data is being intercepted from the protected integrated circuit package.

2. The method as defined in claim 1 wherein the method further comprises selecting the at least one protected component from the group of protected components comprised of integrated circuits and communication pathways.

3. The method as defined in claim 1 wherein the method further comprises detecting changes that are selected from the group of changes comprised of movement of the protected integrated circuit package, and creation of a new connection to the protected integrated circuit package.

4. The method as defined in claim 1 wherein the method further comprises selecting the action to be taken if there are changes in capacitance that indicate that data is being intercepted from the protected integrated circuit package is selected from the group of actions comprised of disabling operation of the at least one protected component, transmitting a signal to another integrated circuit or to another device so that some other device may take action, or erasing data stored in the protected integrated circuit package.

5. The method as defined in claim 1 wherein the method further comprises making the subsequent periodic measurements at periodic intervals to thereby periodically check for changes in capacitance on the protected integrated circuit package.

6. The method as defined in claim 1 wherein the method further comprises disposing a second proximity and touch sensor disposed on a back of the at least one integrated circuit in the redistribution layer so as to protect a back of the protected integrated circuit package.

7. A system for determining if a probe is in proximity of or in direct contact with a protected integrated circuit package, said system comprised of:

at least one integrated circuit in an encapsulant;

a first proximity and touch sensor disposed on a face of the at least one integrated circuit in a redistribution layer;

a redistribution layer disposed on a back of the at least one integrated circuit;

at least one via from the redistribution layer on the face to the redistribution layer on the back; and

a plurality of connectors from outside the protected integrated circuit package to the redistribution layer on the back.

8. The system as defined in claim 7 wherein the system is further comprised of selecting the protected integrated circuit package from the group of protected components comprised of integrated circuits and communication pathways.

9. The system as defined in claim 7 wherein the system is further comprised of a second proximity and touch sensor disposed on a back of the at least one integrated circuit in the redistribution layer.

10. A method for protecting data in the protected integrated circuit package from being intercepted when being transmitted from the protected integrated circuit package, said method comprising:

1) providing at least one integrated circuit that provides drive and sense capabilities for a first capacitive proximity and touch sensor, an encapsulant disposed around the at least one integrated circuit and forming a face and a back, a first array of electrodes disposed on top of the encapsulant of the face of the at least one integrated circuit, a dielectric material disposed on top of the first array of electrodes, a second array of electrodes disposed on top of the dielectric material and substantially orthogonal to the first array of electrodes, the first array and second array of electrodes forming a sensor for the first capacitive proximity and touch sensor, a plurality of vias from the face to the backside through the encapsulant in order to make electrical connections between the at least one integrated circuit, the first array of electrodes and the second array of electrodes.

2) making a baseline measurement of an environment around the protected integrated circuit package;

3) recording the baseline measurement;

4) making subsequent periodic measurements;

5) comparing the baseline measurement and the subsequent periodic measurements to determine if there are changes in capacitance around the protected integrated circuit package; and

6) performing an action if there are changes in capacitance that indicate that data is being intercepted from the protected integrated circuit package.

11. The system as defined in claim 10 wherein the system is further comprised of a second capacitive proximity and touch sensor disposed on a back of the at least one integrated circuit.

13. The system as defined in claim 10 wherein the system is further comprised of a second capacitive proximity and touch sensor disposed on a back of the at least one integrated circuit.

12. A system for disposing a capacitive proximity and touch sensor in an integrated circuit package, said system comprised of:

at least one integrated circuit that provides drive and sense capabilities for a capacitive proximity and touch sensor;

an encapsulant disposed around the at least one integrated circuit and forming a face and a back;

a first array of electrodes disposed on top of the encapsulant of the face of the at least one integrated circuit;

a dielectric material disposed on top of the first array of electrodes;

a second array of electrodes disposed on top of the dielectric material and substantially orthogonal to the first array of electrodes, the first array and the second array forming a first capacitive proximity and touch sensor; and

a plurality of vias from the face to the backside through the encapsulant in order to make electrical connections between the at least one integrated circuit, the first array of electrodes and the second array of electrodes.