LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODES
First Claim
1. A light emitting diode, comprising:
- a substrate;
a first undoped gallium nitride (GaN) layer formed on the substrate, the first undoped GaN layer defining a groove in an upper surface thereof;
a distributed Bragg reflector formed in the groove of the first undoped GaN layer, the distributed Bragg reflector comprising a plurality of second undoped GaN layers and a plurality of air gaps alternately stacked one on the other;
an n-type GaN layer, an active layer and a p-type GaN layer formed in that sequence on the first undoped GaN layer and the distributed Bragg reflector; and
a p-type electrode and a n-type electrode, electrically connected with the p-type GaN layer and the n-type GaN layer, respectively.
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Accused Products
Abstract
An exemplary light emitting diode includes a substrate and a first undoped gallium nitride (GaN) layer formed on the substrate. The first undoped GaN layer defines a groove in an upper surface thereof. A distributed Bragg reflector is formed in the groove of the first undoped GaN layer. The distributed Bragg reflector includes a plurality of second undoped GaN layers and a plurality of air gaps alternately stacked one on the other. An n-type GaN layer, an active layer and a p-type GaN layer are formed on the distributed Bragg reflector and the first undoped GaN layer. A p-type electrode and an n-type electrode are electrically connected with the p-type GaN layer and the n-type GaN layer, respectively. A method for manufacturing plural such light emitting diodes is also provided.
22 Citations
20 Claims
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1. A light emitting diode, comprising:
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a substrate; a first undoped gallium nitride (GaN) layer formed on the substrate, the first undoped GaN layer defining a groove in an upper surface thereof; a distributed Bragg reflector formed in the groove of the first undoped GaN layer, the distributed Bragg reflector comprising a plurality of second undoped GaN layers and a plurality of air gaps alternately stacked one on the other; an n-type GaN layer, an active layer and a p-type GaN layer formed in that sequence on the first undoped GaN layer and the distributed Bragg reflector; and a p-type electrode and a n-type electrode, electrically connected with the p-type GaN layer and the n-type GaN layer, respectively. - View Dependent Claims (2, 3, 4)
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5. A method for manufacturing a plurality of light emitting diodes, the method comprising:
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providing a substrate; forming a first undoped gallium nitride (GaN) layer on the substrate, an upper surface of the first undoped GaN layer being divided into a plurality of first areas and a plurality of second areas; etching the first areas of the upper surface of the first undoped GaN layer to form a plurality of grooves; forming a semiconductor structure inside each of the grooves and on each of the second areas of the upper surface of the first undoped GaN layer, each semiconductor structure comprising a plurality of second undoped GaN layers and a plurality of aluminum nitride (AlN) layers alternately stacked one on the other, a topmost one of the second undoped GaN layers being located at a top side of the semiconductor structure, and a bottommost one of the AlN layers being located at a bottom side of the semiconductor structure; etching away the AlN layers on the second areas thereby removing the AlN layers and the second undoped GaN layers from the second areas; forming an n-type GaN layer, an active layer and a p-type GaN layer, in that sequence, on upper surfaces of the topmost second undoped GaN layers and the second areas of the upper surface of the first undoped GaN layer; removing the AlN layers inside the grooves to form air gaps, the second undoped GaN layers and the air gaps in each groove cooperatively forming a distributed Bragg reflector; and cutting the substrate to form a plurality of individual light emitting diodes. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for manufacturing a plurality of light emitting diodes, the method comprising:
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providing a substrate; forming a first undoped gallium nitride (GaN) layer on the substrate, an upper surface of the first undoped GaN layer being divided into a plurality of first areas and a plurality of second areas; etching the first areas of the upper surface of the first undoped GaN layer to form a plurality of grooves; forming a semiconductor structure inside each of the grooves and on each of the second areas of the upper surface of the first undoped GaN layer, each semiconductor structure comprising a plurality of n-type GaN layers and a plurality of second undoped GaN layers alternately stacked one on the other, a topmost one of the second undoped GaN layers being located at a top side of the semiconductor structure, and a bottommost one of the n-type GaN layers being located at a bottom of the semiconductor structure; etching away the n-type GaN layers on the second areas thereby removing the n-type GaN layers and the second undoped GaN layers from the second areas; forming an n-type GaN layer, an active layer and a p-type GaN layer, in that sequence, on upper surfaces of the topmost second undoped GaN layers and the second areas of the upper surface of the first undoped GaN layer; removing the n-type GaN layers inside the grooves to form air gaps, the second undoped GaN layers and the air gaps in each groove cooperatively forming a distributed Bragg reflector; and cutting the substrate to form a plurality of individual light emitting diodes. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification