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LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

  • US 20140306248A1
  • Filed: 04/26/2013
  • Published: 10/16/2014
  • Est. Priority Date: 04/30/2012
  • Status: Active Grant
First Claim
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1. A light emitting diode package, comprising;

  • a substrate;

    a plurality of LED cells formed on the substrate;

    two or more groups including two or more cells;

    p type electrodes formed on top of the cells;

    insulation layer exposing underlying n layer with trench formed by etching a part of area around the cells;

    n type contact electrode which is elongated from the n layer of the cells and formed on n type nitride semiconductor layer exposed by trench; and

    two P type contact electrodes which are elongated from each p type electrodes of the two groups and formed on the insulation layer which is formed on the n type semiconductor,.

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