HEAT SINK BASE AND SHIELD
First Claim
Patent Images
1. A heat sink comprising:
- a base to be mounted to a computing system to receive a component, wherein the base is to thermally couple a first face of the component to the base; and
a shield to be mounted to the base to thermally couple a second face of the component to the shield.
1 Assignment
0 Petitions
Accused Products
Abstract
A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.
31 Citations
15 Claims
-
1. A heat sink comprising:
-
a base to be mounted to a computing system to receive a component, wherein the base is to thermally couple a first face of the component to the base; and a shield to be mounted to the base to thermally couple a second face of the component to the shield. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A computing system comprising:
-
a printed circuit board (PCB); a base to secure a component to the PCB, wherein the base is to transfer heat from a first face of the component; and a shield to be thermally coupled to the base, wherein the shield is to transfer heat from a second face of the component. - View Dependent Claims (9, 10, 11)
-
-
12. A method comprising:
-
mounting a component of a computing system to a heat sink base mounted to the computing system; thermally coupling a first face of the component to the base; and thermally coupling a second face of the component to a heat sink shield coupled to the base. - View Dependent Claims (13, 14, 15)
-
Specification