HEAT SINK BASE AND SHIELD

• US 20140307385A1
• Filed: 12/22/2011
• Published: 10/16/2014
• Est. Priority Date: 12/22/2011
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Walker, Paul N., Moore, Earl W.
• Granted Patent: US 9,606,590 B2
• Time in Patent Office: Days
• US Class Current: 361/679.54
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.

Claims

1. A heat sink comprising:

a base to be mounted to a computing system to receive a component, wherein the base is to thermally couple a first face of the component to the base; and

a shield to be mounted to the base to thermally couple a second face of the component to the shield.

2. The heat sink of claim 1, wherein the base and shield are formed of heat conductive materials to spread heat generated by the component.

3. The heat sink of claim 1, wherein the shield is removably coupled to the base using screw points.

4. The heat sink of claim 1, wherein the shield is pivotably coupled to the base.

5. The heat sink of claim 1, wherein at least one of the base and the shield is contoured based on the component.

6. The heat sink of claim 1, further comprising a thermal interface material (TIM) to thermally couple the component.

7. The heat sink of claim 1, wherein the component is a memory module and the base includes at least one fastener to releasably couple the memory module to the base.

8. A computing system comprising:

a printed circuit board (PCB);

a base to secure a component to the PCB, wherein the base is to transfer heat from a first face of the component; and

a shield to be thermally coupled to the base, wherein the shield is to transfer heat from a second face of the component.

9. The computing system of claim 8, further comprising a body surface in close proximity to the component;

wherein the shield is to prevent a hot spot on the body surface due to heat from the component.

10. The computing system of claim 8, wherein the base includes a slot to admit an electrical interface of the component to interface with the computing system.

11. The computing system of claim 8, further comprising at least one air passage between the base and the PCB.

12. A method comprising:

mounting a component of a computing system to a heat sink base mounted to the computing system;

thermally coupling a first face of the component to the base; and

thermally coupling a second face of the component to a heat sink shield coupled to the base.

13. The method of claim 12, further comprising spreading thermally coupled heat from the component across the shield to eliminate localized hot spots associated with the component.

14. The method of claim 12, further comprising removably coupling the shield to the base to allow installation of the component at the base.

15. The method of claim 12, further comprising pivotably coupling the shield to the base, wherein the shield includes an open position to install the component in the base, and wherein the shield includes a closed position wherein the shield is thermally coupled to the base to transfer heat between the shield and the base.