INTEGRATED CIRCUIT PACKAGE FOR HEAT DISSIPATION
First Claim
1. An apparatus for enclosing an electronic component to a base, comprising:
- an enclosure attached to a base and surrounding an electronic component;
the enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base;
wherein the second portion of the enclosure is attached to the base;
wherein the first portion of the enclosure is attached to the second portion of the enclosure;
the enclosure including one or more extruding elements on an exterior surface of the enclosure; and
wherein the one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.
4 Assignments
0 Petitions
Accused Products
Abstract
An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.
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Citations
20 Claims
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1. An apparatus for enclosing an electronic component to a base, comprising:
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an enclosure attached to a base and surrounding an electronic component; the enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base; wherein the second portion of the enclosure is attached to the base; wherein the first portion of the enclosure is attached to the second portion of the enclosure; the enclosure including one or more extruding elements on an exterior surface of the enclosure; and wherein the one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification