INTEGRATED CIRCUIT PACKAGE FOR HEAT DISSIPATION

• US 20140307390A1
• Filed: 04/12/2013
• Published: 10/16/2014
• Est. Priority Date: 04/12/2013
• Status: Active Grant

• Current Assignee: Lenovo International Limited (Lenovo Group Ltd.)
• Original Assignee: International Business Machines Corporation
• Inventors: Baker, Anthony E., Flint, Stephen J., Meng, Jian
• Granted Patent: US 9,230,878 B2
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Abstract

An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.

Claims

1. An apparatus for enclosing an electronic component to a base, comprising:

an enclosure attached to a base and surrounding an electronic component;

the enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base;

wherein the second portion of the enclosure is attached to the base;

wherein the first portion of the enclosure is attached to the second portion of the enclosure;

the enclosure including one or more extruding elements on an exterior surface of the enclosure; and

wherein the one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.

2. The apparatus of claim 1, wherein the one or more extruding elements of the enclosure are included on a top exterior surface of the first portion.

3. The apparatus of claim 2, wherein the top exterior surface of the first portion includes at least two extruding elements, wherein the at least two extruding elements are uniform in height.

4. The apparatus of claim 3, wherein the at least two extruding elements are symmetrically aligned with one and other.

5. The apparatus of claim 3, wherein each of the at least two extruding elements have a triangular cross-sectional shape along the length thereof.

6. The apparatus of claim 3, wherein each of the at least two extruding elements have a rectangular cross-sectional shape along the length thereof.

7. The apparatus of claim 1, wherein the one or more extruding elements of the enclosure are included on a surface of the second portion.

8. The apparatus of claim 7, wherein the surface of the second portion includes at least two extruding elements, wherein the at least two extruding elements are uniform in height.

9. The apparatus of claim 8, wherein the at least two extruding elements are symmetrically aligned with one and other.

10. The apparatus of claim 8, wherein each of the at least two extruding elements have a triangular cross-sectional shape along the length thereof.

11. The apparatus of claim 8, wherein each of the at least two extruding elements have a rectangular cross-sectional shape along the length thereof.

12. The apparatus of claim 2, further comprising:

a heat sink divided into a first portion and a second portion along a second plane, wherein the second plane is substantially parallel to the base; and

wherein the second portion of the heat sink is attached to the first portion of the enclosure.

13. The apparatus of claim 12, wherein the second portion of the heat sink is attached to a top surface of the first portion of the enclosure.

14. The apparatus of claim 13, wherein a surface of the second portion of the heat sink attached to the surface of the first portion of the enclosure includes one or more elements.

15. The apparatus of claim 14, wherein the one or more elements of the heat sink have a triangular cross-sectional shape along the length thereof.

16. The apparatus of claim 14, wherein the one or more elements of the heat sink have a rectangular cross-sectional shape along the length thereof.

17. The apparatus of claim 14, wherein a thermal adhesive detachably attaches the one or more elements of the heat sink to the one or more extruding elements of the enclosure.

18. The apparatus of claim 14, wherein at least two elements of the heat sink are symmetrical to one and other.

19. The apparatus of claim 14, wherein the one or more elements of the heat sink are substantially aligned in parallel with the one or more extruding elements of the enclosure.

20. The apparatus of claim 5, further comprising:

a heat sink divided into a first portion and a second portion along a second plane, wherein the second plane is substantially parallel to the base;

wherein the second portion of the heat sink is attached to the first portion of the enclosure;

wherein a surface of the second portion of the heat sink attached to the surface of the first portion of the enclosure includes one or more elements; and

wherein the one or more elements of the heat sink have a triangular cross-sectional shape along the length thereof.