Transistor, the Preparation Method Therefore, and Display Panel

• US 20140312341A1
• Filed: 04/24/2013
• Published: 10/23/2014
• Est. Priority Date: 04/22/2013
• Status: Abandoned Application

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Chiang, Cheng-Lung, Chen, Po-Lin
• Application Number:
  US13/884,299
• Publication Number:
  US 20140312341A1
• Time in Patent Office: Days
• US Class Current: 257/43
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

The present invention discloses a transistor, the preparation method thereof, and a display panel. The transistor comprises: a gate electrode; a gate insulating layer covering the gate electrode; an oxide semiconductor layer formed on the gate insulating layer; a first protective layer formed on the oxide semiconductor layer; a source/drain electrode connected with the oxide semiconductor layer; and a second protective layer covering the source/drain electrode; wherein, the hydrogen atom content per unit volume of the first protective layer is less than that of the gate insulating layer, and the hydrogen atom content per unit volume of the gate insulating layer is less than that of the second protective layer. Through the above solutions, the present invention can suppress the combination of the oxygen atom of the semiconductor layer in the transistor and the external hydrogen atom, to improve the performance and stability of the device.

Claims

1. A transistor, wherein, it comprises:

a gate electrode;

a gate insulating layer, covering the gate electrode;

an oxide semiconductor layer, formed on the gate insulating layer;

a first protective layer, formed on the oxide semiconductor layer;

a source/drain electrode, connected with the oxide semiconductor layer; and

a second protective layer, covering the source/drain electrode;

wherein, the hydrogen atom content per unit volume of the first protective layer is less than that of the gate insulating layer, the hydrogen atom content per unit volume of the gate insulating layer is less than that of the second protective layer.

2. The transistor as claimed in claim 1, wherein, the gate insulating layer is a silicon oxide layer with the hydrogen atom content per unit volume between 5% and 10%.

3. The transistor as claimed in claim 1, wherein, the first protective layer is a silicon oxide layer with the hydrogen atom content per unit volume between 0% and 5%.

4. The transistor as claimed in claim 1, wherein, the second protective layer is a silicon nitride layer with the hydrogen atom content per unit volume more than 20%.

5. A display panel, wherein, it comprises a transistor, which comprises:

a gate electrode;

a gate insulating layer, covering the gate electrode;

an oxide semiconductor layer, formed on the gate insulating layer;

a first protective layer, formed on the oxide semiconductor layer;

a source/drain electrode, connected with the oxide semiconductor layer; and

a second protective layer, covering the source/drain electrode;

wherein, the hydrogen atom content per unit volume of the first protective layer is less than that of the gate insulating layer, the hydrogen atom content per unit volume of the gate insulating layer is less than that of the second protective layer.

6. The display panel as claimed in claim 5, wherein, the gate insulating layer is a silicon oxide layer with the hydrogen atom content per unit volume between 5% and 10%.

7. The display panel as claimed in claim 5, wherein, the first protective layer is a silicon oxide layer with the hydrogen atom content per unit volume between 0% and 5%.

8. The display panel as claimed in claim 5, wherein, the second protective layer is a silicon nitride layer with the hydrogen atom content per unit volume more than 20%.

9. An preparation method of transistor, wherein, it comprises:

forming a gate electrode on a substrate;

forming a gate insulating layer on the gate electrode, which covers the gate electrode;

forming an oxide semiconductor layer on the gate insulating layer;

forming a first protective layer on the oxide semiconductor layer, controlling the hydrogen atom content per unit volume of the protective layer less than that of the gate insulating layer;

forming a source/drain electrode on the first protective layer; and

forming a second protective layer on the source/drain electrode, which covers the source/drain electrode, controlling the hydrogen atom content per unit volume of the second protective layer more than that of the gate insulating layer.

10. The preparation method as claimed in claim 9, wherein,

the step of forming a gate insulating layer on the gate electrode, which covers the gate electrode comprises:

utilizing the mixed gas of TEOS or SiH₄ mixed with at least one of N₂O, N₂, O₂, and O₃ to form the gate insulating layer with the hydrogen atom content per unit volume between 5% and 10% on the gate electrode through the chemical vapor deposition method, which covers the gate electrode;

the step of forming a first protective layer on the oxide semiconductor layer comprises;

utilizing the mixed gas of TEOS or SiH₄ mixed with at least one of N₂O, N₂, O₂, and O₃ to form the first protective layer with the hydrogen atom content per unit volume between 0% and 5% on the oxide semiconductor layer through the chemical vapor deposition method.

11. The preparation method as claimed in claim 9, wherein,

the step of forming a second protective layer on the source/drain electrode, which covers the source/drain electrode comprises:

utilizing the mixed gas of SiH₄, N₂, and NH₃ to form the second protective layer with the hydrogen atom content per unit volume more than 20% on the source/drain electrode through the chemical vapor deposition method, which covers the source/drain electrode.