CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
First Claim
1. A chip package, comprising:
- a semiconductor chip with an upper surface and a lower surface, the semiconductor chip having at least one first conducting pad disposed on the lower surface, and a first hole corresponding to the first conducting pad on the lower surface, the first hole extending from the upper surface to the lower surface to expose the first conducting pad;
an isolation layer extending from the upper surface to the lower surface, part of the isolation layer positioned in the first hole, wherein the isolation layer has at least one opening to expose the first conducting pad;
a redistributing metal layer disposed on the isolation layer and having at least one redistributing metal line corresponding to the first conducting pad, and the redistributing metal line electrically connecting to the first conducting pad through the opening; and
at least one bonding pad disposed on the isolation layer and positioned at a side of the semiconductor chip,wherein the redistributing metal line extends to the bonding pad to electrically connect the bonding pad positioned at the side and the first conducting pad disposed on the lower surface of the semiconductor chip.
1 Assignment
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Accused Products
Abstract
A chip package is provided. The chip package comprises a semiconductor chip, an isolation layer, a redistributing metal layer, and a bonding pad. The semiconductor chip has a first conducting pad disposed on a lower surface, and a first hole corresponding to the first conducting pad. The first hole and the isolation layer extend from an upper surface to the lower surface to expose the first conducting pad. The redistributing metal layer is disposed on the isolation layer and has a redistributing metal line corresponding to the first conducting pad, the redistributing metal line is connected to the first conducting pad through the opening. The bonding pad is disposed on the isolation layer and one side of the semiconductor chip, wherein the redistributing metal line extends to the bonding pad to electrically connect the first conducting pad to the bonding pad. A method thereof is also provided.
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Citations
16 Claims
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1. A chip package, comprising:
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a semiconductor chip with an upper surface and a lower surface, the semiconductor chip having at least one first conducting pad disposed on the lower surface, and a first hole corresponding to the first conducting pad on the lower surface, the first hole extending from the upper surface to the lower surface to expose the first conducting pad; an isolation layer extending from the upper surface to the lower surface, part of the isolation layer positioned in the first hole, wherein the isolation layer has at least one opening to expose the first conducting pad; a redistributing metal layer disposed on the isolation layer and having at least one redistributing metal line corresponding to the first conducting pad, and the redistributing metal line electrically connecting to the first conducting pad through the opening; and at least one bonding pad disposed on the isolation layer and positioned at a side of the semiconductor chip, wherein the redistributing metal line extends to the bonding pad to electrically connect the bonding pad positioned at the side and the first conducting pad disposed on the lower surface of the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a chip package, comprising:
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forming a semiconductor chip with an upper surface and a lower surface, the semiconductor chip having at least one first conducting pad disposed on the lower surface, and at least one first hole extending from the upper surface to the lower surface to expose the first conducting pad; forming an isolation layer extending from the upper surface to the lower surface, part of the isolation layer is disposed in the first hole, wherein the isolation layer has at least one opening to expose the first conducting pad; forming at least one redistributing metal line on the isolation layer, the redistributing metal line electrically connected to the first conducting pad through the opening; and forming at least one bonding pad disposed on the isolation layer and positioned at a side of the semiconductor chip, wherein the redistributing metal line extends to the bonding pad to electrically connect the bonding pad positioned at the side and the first conducting pad disposed on the lower surface of the semiconductor chip. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification