WIRELESS ENERGY TRANSFER RESONATOR ENCLOSURES

• US 20140312707A1
• Filed: 02/27/2014
• Published: 10/23/2014
• Est. Priority Date: 09/27/2008
• Status: Abandoned Application

• Current Assignee: WiTricity Corporation
• Original Assignee: WiTricity Corporation
• Inventors: Fiorello, Ron, Kesler, Morris P., Kurs, Andre B., Kulikowski, Konrad J., Ganem, Steven J.
• Application Number:
  US14/191,960
• Publication Number:
  US 20140312707A1
• Time in Patent Office: Days
• US Class Current: 307/104
• CPC Class Codes: H01F 2003/005 Magnetic cores for receiving several windings with perpendicular axes, e.g. for antennae or inductive power transfer
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/50 using additional energy repeaters between transmitting devices and receiving devices
• CPC Class Codes: H02J 50/60 responsive to the presence of foreign objects, e.g. detection of living beings
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H02J 50/90 involving detection or optimisation of position, e.g. alignment
• CPC Class Codes: H02J 7/00304 Overcurrent protection
• CPC Class Codes: H02J 7/0047 with monitoring or indicating devices or circuits
• CPC Class Codes: H03H 7/40 Automatic matching of load impedance to source impedance
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

Described herein are improved configurations for a resonator enclosure for wireless high power transfer that includes a support plate, a sheet of good conductor positioned on one side of the support plate, a separator piece for maintaining a separation distance between the resonator and the sheet of good conductor, and a cover of a non-lossy material covering the resonator, the separator, the sheet of good conductor and attached to the support plate, wherein the size of the sheet of good conductor is larger than the size of the resonator.

Claims

1. A resonator assembly for wireless high-power transfer, comprising:

a sheet of high conductivity material, having a first side and a second side; and

a magnetic resonator comprising at least one inductive coupling element and at least one capacitor and having a resonant frequency;

wherein the at least one capacitor is positioned on the first side of the sheet of high conductivity material and the at least one inductive coupling element is positioned on the second side of the sheet of high conductivity material.

2. The assembly of claim 1, wherein the high conductivity material comprises copper.

3. The assembly of claim 1, wherein the high conductivity material comprises aluminum.

4. The assembly of claim 1, wherein the high conductivity material is thicker than the skin depth of the conductor at the resonant frequency.

5. The assembly of claim 1, wherein the high conductivity material is thicker than the skin depth of the conductor at the resonant frequency.

6. The assembly of claim 1, wherein the high conductivity material is thicker than 0.25 mm.

7. The assembly of claim 1, wherein the high conductivity material is thicker than 0.5 mm.

8. The assembly of claim 1, wherein the magnetic resonator is a planar resonator.

9. The assembly of claim 1, wherein the resonant frequency of the resonator is between 10 kHz and 100 MHz.

10. The assembly of claim 1, wherein the resonant frequency of the resonator is between 10 kHz and 100 kHz.

11. The assembly of claim 1, further comprising a separator piece positioned between the at least one inductive coupling element and the sheet of high conductivity material.

12. A packaged resonator assembly for wireless high-power transfer, comprising:

a resonator assembly, comprising a high conductivity material;

a printed circuit board comprising power and control circuitry;

a support plate; and

a cover, enclosing at least the resonator assembly and the printed circuit board;

wherein the high conductivity material is in substantial thermal contact with the support plate.

13. The packaged resonator assembly of claim 12, further comprising components utilized to enable a safety system of a wireless power transfer system.

14. The packaged resonator assembly of claim 12, further comprising components utilized to enable a control system of a wireless power transfer system.

15. The packaged resonator assembly of claim 12, further comprising components utilized to enable a monitor system of a wireless power transfer system.

16. The packaged resonator assembly of claim 12, further comprising components utilized to enable a billing system of a wireless power transfer system.

17. The packaged resonator assembly of claim 12, further comprising at least one temperature sensor mounted on the printed circuit board.

18. The packaged resonator assembly of claim 12, further comprising at least one voltage sensor mounted on the printed circuit board.

19. The packaged resonator assembly of claim 12, further comprising at least one current sensor mounted on the printed circuit board.

20. The packaged resonator assembly of claim 12, further comprising mounting components for mounting the resonator to the underside of a vehicle.

21. The packaged resonator assembly of claim 12, further comprising connection components for connecting to a system of the vehicle.

22. The packaged resonator assembly of claim 21, wherein the system of the vehicle comprises any of a cooling system or a heating system.