OPTICAL CONNECTOR HAVING REDUCED SIZE

• US 20140314369A1
• Filed: 10/30/2013
• Published: 10/23/2014
• Est. Priority Date: 04/23/2013
• Status: Active Grant

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: TSENG, KUO-FONG
• Granted Patent: US 9,244,233 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]

Abstract

An optical waveguide includes a printed circuit board, a waveguide, a light emitter, a light receiver, a transparent driver, and a transparent processor. The driver and the processor are received in and mounted to the printed circuit board through a flip-flop method. The light emitter and the light receiver are mounted to the driver and the processor, respectively, through the flip-flop method. The planar waveguide is attached to a side of the printed circuit board opposite to the light emitter and the light receiver. The driver drives the light emitter to emit light according to input signals. This light is directed onto the light receiver through the driver, the planar waveguide, and the processor. The light receiver converts the light into electrical signals. The processor processes the electrical signals to obtain the input signals.

Claims

1. An optical connector, comprising:

a printed circuit board;

a transparent driver and a transparent processor both received within and electrically connected to the printed circuit board by a flip-flop technology;

a light emitter and a light receiver mounted to and electrically connected to the driver and the processor respectively by the flip-flop technology; and

a planar waveguide attached to a side of the printed circuit board opposite to the light emitter and the light receiver;

wherein the driver drives the light emitter to emit light according to input signals, which is directed to the light receiver through the driver, the planar waveguide, and the processor, the light receiver converts the light into electrical signals, and the processor processes the electrical signals to obtain the input signals.

2. The optical connector of claim 1, wherein the printed circuit board is made of silicon.

3. The optical connector of claim 1, wherein the substrate comprises a top surface and a bottom surface opposite to the top surface, the substrate defines a first and second through holes extending through the top and bottom surfaces, and the driver and the processor are fittingly received in the first and second through holes respectively.

4. The optical connector of claim 3, wherein the planar waveguide comprises an upper surface and a lower surface opposite to the upper surface, the planar waveguide is attached to the bottom surface such that the upper surface contacts the bottom surface.

5. The optical connector of claim 4, wherein the printed circuit board comprises a plurality of first pads formed in the bottom surface and attached to the upper surface, the first pads are located at an periphery of the first through hole, a part of each first pad extends into the first through hole, the driver comprises a first surface and a second surface opposite to the first surface, the driver comprises a plurality of third connectors formed on an outer periphery of the second surface, and the third connectors are soldered to the first pads.

6. The optical connector of claim 5, wherein the driver comprises a plurality of fifth pads formed on an outer periphery of the first surface, the light emitter comprises a light emitting surface and a plurality of first connectors formed on an outer periphery of the light emitting surface, and the first connectors are soldered to the fifth pads.

7. The optical connector of claim 5, wherein the substrate also comprises a plurality of third pads and a plurality of first vias, the third pads are formed on the top surface and adjacent to the first through hole, the first vias extend through the top surface and the bottom surface and interconnect the first pads with the third pads in a desired manner, the optical connector also comprises a controller, the controller comprises a fifth surface and a plurality of fifth connectors formed on an outer periphery of the fifth surface, the controller is mounted to the substrate using the flip-flop technology, and the fifth connectors are soldered to the third pads, the controller is configured to receiver the input signals and control the driver.

8. The optical connector of claim 4, wherein the printed circuit board comprises a plurality of second pads formed in the bottom surface and attached to the upper surface, the second pads are located at an periphery of the second through hole, a part of each first pad extends into the first through hole, the processor comprises a third surface and a fourth surface opposite to the third surface, the processor comprises a plurality of fourth connectors formed on an outer periphery of the fourth surface, and the third connectors are soldered to the first pads.

9. The optical connector of claim 8, wherein the processor comprises a plurality of sixth pads formed on an outer periphery of the third surface, the light receiver comprises a light receiving surface and a plurality of second connectors formed on an outer periphery of the light receiving surface, and the second connectors are soldered to the sixth pads.

10. The optical connector of claim 8, wherein the substrate also comprises a plurality of fourth pads and a plurality of second vias, the fourth pads are formed on the top surface and adjacent to the second through hole, the second vias extend through the top surface and the bottom surface and interconnect the second pads with the fourth pads in a desired manner, the optical connector also comprises a memory, the memory comprises a sixth surface and a plurality of sixth connectors formed on an outer periphery of the sixth surface, the memory is mounted to the substrate using the flip-flop technology, and the sixth connectors are soldered to the fourth pads, the memory is configured to store the input signals from the processor.

11. The optical connector of claim 4, wherein the planar waveguide comprises a strip-shaped light guide, which is located between the upper surface and the lower surface and is substantially parallel with the upper surface, the light guide is made of a material having a refractive index higher than a refractive index of the other part of the planar waveguide, the light guide comprises two sloped end surfaces, planes coplanar with the end surfaces intersect with each other at about 90 degrees at a side of the lower surface opposite to the light guide, included angles between the sloped end surfaces and the upper surface are about 45 degrees, orthogonal projections of the sloped end surfaces onto the upper surface respectively fall within orthogonal projections of the light emitter and the light receiver onto the upper surface.

12. The optical connector of claim 1, wherein the light emitter is selected from the group consisting of a laser diode and a light emitting diode.

13. The optical connector of claim 1, wherein the light receiver is a photo diode.