ADHESIVE SUBSTANCE, IN PARTICULAR FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY
First Claim
1. An adhesive for encapsulating an electronic arrangement, the adhesive comprising(a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which has a softening temperature of greater than 40°
- C.,(b) at least one kind of an at least partly hydrogenated tackifier resin,(c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40°
C., and(d) at least one kind of a photoinitiator for initiating cationic curing.
2 Assignments
0 Petitions
Accused Products
Abstract
An adhesive and method for encapsulating an electronic arrangement with respect to permeants, wherein the adhesive and method have (a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which, considered as hypothetical homopolymer, has a softening temperature of greater than 40° C., (b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., preferably less than 20° C., and (d) at least one kind of a photoinitiator for initiating cationic curing
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Citations
24 Claims
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1. An adhesive for encapsulating an electronic arrangement, the adhesive comprising
(a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which has a softening temperature of greater than 40° - C.,
(b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40°
C., and(d) at least one kind of a photoinitiator for initiating cationic curing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
- C.,
Specification