ADHESIVE SUBSTANCE, IN PARTICULAR FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY

• US 20140315016A1
• Filed: 10/19/2012
• Published: 10/23/2014
• Est. Priority Date: 10/21/2011
• Status: Abandoned Application

• Current Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Original Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Inventors: Dollase, Thilo, Krawinkel, Thorsten, Bai, Minyoung
• Application Number:
  US14/351,800
• Publication Number:
  US 20140315016A1
• Time in Patent Office: Days
• US Class Current: 428/339
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 17/10 of synthetic resin
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C03C 27/10 with the aid of adhesive specially adapted for that purpose
• CPC Class Codes: C08L 53/00 Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 93/00 Compositions of natural resins; Compositions of derivatives thereof of polysaccharides C08L1/00 - C08L5/00; of natural rubber C08L7/00
• CPC Class Codes: C08L 93/04 Rosin
• CPC Class Codes: C09J 153/00 Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09J 193/00 Adhesives based on natural resins; Adhesives based on derivatives thereof
• CPC Class Codes: C09J 193/04 Rosin
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2453/00 Presence of block copolymer
• CPC Class Codes: C09J 7/387 Block-copolymers
• CPC Class Codes: C09K 3/10 Materials in mouldable or extrudable form for sealing or packing joints or covers filling pastes C09D5/34
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0481 characterised by the composition of the encapsulation material
• CPC Class Codes: H10K 2102/311 : Flexible OLED
• CPC Class Codes: H10K 50/80 : Constructional details
• CPC Class Codes: H10K 50/8426 : Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 : Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 77/00 : Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
• CPC Class Codes: Y02E 10/50 : Photovoltaic [PV] energy
• CPC Class Codes: Y10T 428/269 : including synthetic resin or polymer layer or component
• CPC Class Codes: Y10T 428/287 : including epoxy group or epoxy polymer

Abstract

An adhesive and method for encapsulating an electronic arrangement with respect to permeants, wherein the adhesive and method have (a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which, considered as hypothetical homopolymer, has a softening temperature of greater than 40° C., (b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., preferably less than 20° C., and (d) at least one kind of a photoinitiator for initiating cationic curing

Claims

1. An adhesive for encapsulating an electronic arrangement, the adhesive comprising

(a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which has a softening temperature of greater than 40°

C.,

(b) at least one kind of an at least partly hydrogenated tackifier resin,

(c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40°

C., and

(d) at least one kind of a photoinitiator for initiating cationic curing.

2. The adhesive according to claim 1, wherein the copolymer or copolymers is or are random, alternating, block, star and/or graft copolymers having a molar mass M_W, of 300 000 g/mol or less.

3. The adhesive according to claim 1, wherein the copolymer or copolymers is or are block, star and/or graft copolymers which contain at least one kind of a first soft polymer block having a softening temperature of less than −

20°

C. and at least one kind of a second hard polymer block having a softening temperature of greater than +40°

C.

4. The adhesive according to claim 3, wherein the first soft polymer block is of apolar construction and comprises butylene or isobutylene as homopolymer block or copolymer block, wherein, when the first soft polymer block is copolymer block, the first soft polymer block is copolymerized with itself or with one another or with further comonomers.

5. The adhesive according to claim 3, wherein the second hard polymer block is constructed from styrene, styrene derivatives and/or from other aromatic or (cyclo)aliphatic hydrocarbon monomers or from methacrylates or from acrylates.

6. The adhesive according to claim 3 wherein

at least one block copolymer is a triblock copolymer constructed from two terminal hard blocks and one middle soft block.

7. The adhesive according to claim 1 wherein

the tackifier resin or resins has or have a degree of hydrogenation of at least 70%.

8. The adhesive according to claim 1 wherein

the adhesive comprises at least one resin which has a DACP of more than 30°

C. and a MMAP of more than 50°

C.

9. The adhesive according to claim 1 wherein

the adhesive comprises at least one reactive resin that carries at least one epoxy group or at least one oxetane group.

10. The adhesive according to claim 1 wherein

the adhesive comprises at least one reactive resin which is aliphatic or cycloaliphatic in nature.

11. The adhesive according to claim 1 wherein

the adhesive comprises photoinitiators that absorb UV light below 350 nm, that permit cationic curing, and that include sulphonium, iodonium and metallocene-based systems.

12. The adhesive according to claim 11 wherein the

photoinitiators absorb UV light above 250 nm and below 350 nm.

13. The adhesive according to claim 1 wherein the adhesive is a

pressure-sensitive adhesive that comprises one or more additives selected from the group consisting of plasticizers, primary antioxidants, secondary antioxidants, process stabilizers, light stabilizers, processing assistants, endblock reinforcer resins, and polymers.

14. The adhesive according to claim 13 wherein

the pressure-sensitive adhesive comprises one or more nanoscale fillers, transparent fillers and/or getter and/or scavenger fillers.

15. The adhesive according to claim 1 wherein

the adhesive is transparent in the visible light of the spectrum having a wavelength range from about 400 nm to 800 nm.

16. The adhesive according to claim 1 wherein

the adhesive exhibits a haze of less than 5.0%.

17. An adhesive tape comprising at least one layer of the adhesive according to claim 1 and a carrier, wherein the carrier has a permeation barrier of WVTR<

0.1 g/(m² d) and OTR<

0.1 cm³/(m² d bar).

18. The adhesive tape according to claim 17, wherein the carrier is a coated polymeric film.

19. The adhesive tape according to claim 17, wherein the carrier has a layer of a flexible thin glass with a layer thickness of not more 100 μ

m, wherein the thin glass is a borosilicate glass or an alkali-free aluminoborosilicate glass.

20. The adhesive according to claim 19, wherein the thin glass is present in a tape-like geometry.

21. A method for encapsulating an electronic arrangement, the method comprising:

encapsulating an (opto) electronic arrangement with the adhesive according to claim 1.

22. The method according to claim 21, wherein the adhesive or regions of the (opto)electronic arrangement that are to be encapsulated with the adhesive are heated before, during or after application of the adhesive.

23. The method according to claim 21, wherein the adhesive is cured partly or to completion on the electronic arrangement after application.

24. An electronic arrangement having an organic electronic structure, and a pressure-sensitive adhesive, the electronic structure being at least partly encapsulated by the pressure-sensitive adhesive, wherein

the pressure-sensitive adhesive comprises the adhesive according to claim 1.