MULTI-CHIP SOCKET

• US 20140315435A1
• Filed: 07/03/2014
• Published: 10/23/2014
• Est. Priority Date: 06/29/2012
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Leigh, Kevin B., Megason, George D.
• Granted Patent: US 9,232,681 B2
• Time in Patent Office: Days
• US Class Current: 439/620.21
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 12/712 co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit H01R12/72 takes precedence
• CPC Class Codes: H01R 43/205 with a panel or printed circuit board
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 2201/10962 Component not directly connected to the PCB
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 7/10 Plug-in assemblages of components , e.g. IC sockets
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A multi-chip socket includes a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip. A second cavity has a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip. The first support surface is in a first plane, and the second support surface is in a second plane, where the first plane is angled with respect to the second plane.

Claims

1. An apparatus comprising:

a multi-chip socket comprising;

a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip,

a second cavity electrically coupled to the first cavity and having a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip,

wherein the first support surface is in a first plane, and the second support surface is in a second plane, wherein the first plane is angled with respect to the second plane.

2. The apparatus of claim 1, wherein the first plane is a vertical plane, and the second plane is a horizontal plane.

3. The apparatus of claim 1, wherein the multi-chip socket has a plurality of sides, wherein the first cavity is provided at a first of the sides, and the second cavity is provided at a second of the sides, the first side being generally perpendicular to the second side.

4. The apparatus of claim 3, wherein the multi-chip socket further comprises a third cavity at a third of the plurality of sides, the third cavity having a third support surface to support a third component including a third chip, the third support surface arranged to contact and support the third chip.

5. The apparatus of claim 4, wherein the third side is generally perpendicular to each of the first side and the second side.

6. The apparatus of claim 1, wherein the second cavity is to receive multiple components including respective chips.

7. The apparatus of claim 1, wherein the first cavity has a first depth, and the second cavity has a second depth different from the first depth.

8. The apparatus of claim 1, wherein the first chip includes a first integrated circuit (IC) chip, and the second chip includes a second IC chip.

9. A system, comprising:

a multi-chip socket including a first cavity and a second cavity;

a first component including a first integrated circuit (IC) chip disposed within the first cavity, wherein a first support surface of the first cavity is in a first plane, and the first support surface is in contact with and supports the first IC chip;

a second component including a second IC chip communicatively coupled to the first component and disposed within the second cavity, wherein a second support surface of the second cavity is in a second plane that is angled with respect to the first plane, and the second support surface is in contact with and supports the second IC chip.

10. The system of claim 9, wherein the first cavity has a first depth, and the second cavity has a second depth different from the first depth.

11. The system of claim 9, wherein the first plane is a vertical plane, and the second plane is a horizontal plane.

12. The system of claim 9, wherein the multi-chip socket has a plurality of sides, wherein the first cavity is provided at a first of the sides, and the second cavity is provided at a second of the sides, the first side being generally perpendicular to the second side.

13. The system of claim 12, wherein the multi-chip socket further comprises a third cavity at a third of the plurality of sides, the third cavity having a third support surface to support a third component including a third chip, the third support surface arranged to contact and support the third chip.

15. The system of claim 9, wherein the multi-chip socket further comprises a third cavity, and the system further comprises a third component including a second IC chip, wherein a third support surface of the first cavity is in a third plane, different from the first and second planes, the third plane generally perpendicular to each of the first and second planes.

16. The system of claim 15, wherein the first plane is a vertical plane, the second plane is a horizontal plane, and the third plane is a vertical plane generally perpendicular to the first plane.

17. The system of claim 9, wherein the first IC chip is a processor and the second IC chip is a memory device.

18. The system of claim 9, wherein the first IC chip is an application specific integrated circuit (ASIC) and the second IC chip is an electrical/optical (E/O) engine.

19. The system of claim 9, further comprising a printed circuit board on which the multi-chip socket is disposed.

14. The system of 13, wherein the third side is generally perpendicular to each of the first side and the second side.

20. A method comprising:

arranging a multi-chip socket on a circuit board, wherein the multi-chip socket comprises;

a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip,

a second cavity electrically coupled to the first cavity and having a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip, wherein the first support surface is in a horizontal plane, and the second support surface is in a vertical plane.