MULTI-CHIP SOCKET
First Claim
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1. An apparatus comprising:
- a multi-chip socket comprising;
a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip,a second cavity electrically coupled to the first cavity and having a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip,wherein the first support surface is in a first plane, and the second support surface is in a second plane, wherein the first plane is angled with respect to the second plane.
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Abstract
A multi-chip socket includes a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip. A second cavity has a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip. The first support surface is in a first plane, and the second support surface is in a second plane, where the first plane is angled with respect to the second plane.
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Citations
20 Claims
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1. An apparatus comprising:
a multi-chip socket comprising; a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip, a second cavity electrically coupled to the first cavity and having a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip, wherein the first support surface is in a first plane, and the second support surface is in a second plane, wherein the first plane is angled with respect to the second plane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system, comprising:
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a multi-chip socket including a first cavity and a second cavity; a first component including a first integrated circuit (IC) chip disposed within the first cavity, wherein a first support surface of the first cavity is in a first plane, and the first support surface is in contact with and supports the first IC chip; a second component including a second IC chip communicatively coupled to the first component and disposed within the second cavity, wherein a second support surface of the second cavity is in a second plane that is angled with respect to the first plane, and the second support surface is in contact with and supports the second IC chip. - View Dependent Claims (10, 11, 12, 13, 15, 16, 17, 18, 19)
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14. The system of 13, wherein the third side is generally perpendicular to each of the first side and the second side.
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20. A method comprising:
arranging a multi-chip socket on a circuit board, wherein the multi-chip socket comprises; a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip, a second cavity electrically coupled to the first cavity and having a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip, wherein the first support surface is in a horizontal plane, and the second support surface is in a vertical plane.
Specification