SEMICONDUCTOR DEVICE

• US 20140319673A1
• Filed: 11/07/2012
• Published: 10/30/2014
• Est. Priority Date: 11/07/2011
• Status: Abandoned Application

• Current Assignee: Daikin Industries Ltd
• Original Assignee: Daikin Industries Ltd
• Inventors: Maeda, Toshiyuki, Zhou, Yueqiang
• Application Number:
  US14/356,459
• Publication Number:
  US 20140319673A1
• Time in Patent Office: Days
• US Class Current: 257/712
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/46 involving the transfer of heat by flowing fluids H01L23/42, H01L23/44 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/492 Bases or plates or solder therefor
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

In a semiconductor device in which a semiconductor chip is cooled by a cooler, an insulating member between a semiconductor chip and a cooler is omitted in order to simplify the configuration. A cooler (23, 24, 25) for performing heat exchange between a semiconductor chip (21, 22) and a refrigerant is provided. The refrigerant is non-conductive. The semiconductor chip (21, 22) and the cooler (23, 24, 25) are connected to each other through a conductive connection component (28) or are directly connected to each other.

Claims

1. A semiconductor device comprising:

a semiconductor chip (21, 22); and

a cooler (23, 24, 25) that performs heat exchange between the semiconductor chip (21, 22) and refrigerant, wherein

the refrigerant is non-conductive, and

the semiconductor chip (21, 22) and the cooler (23, 24, 25) are either connected to each other via a conductive connection component (28) or directly connected to each other.

2. The semiconductor device of claim 1, wherein

the cooler (23, 24, 25) is used as a bus bar that conducts electric current.

3. The semiconductor device of claim 1, wherein

the cooler (23, 24, 25) is connected to an electrode (E, C, . . . ) on the semiconductor chip (21, 22).

4. The semiconductor device of claim 1, wherein

the cooler (23, 24, 25) is located on each surface of the semiconductor chip (21, 22).

5. The semiconductor device of claim 1, wherein

the semiconductor chip (21, 22) comprises a plurality of semiconductor chips (21, 22), and

the plurality of semiconductor chips (21, 22) share the cooler (23, 24, 25).

6. The semiconductor device of claim 1, wherein

the refrigerant is refrigerant of a refrigerant circuit (50) that performs a refrigeration cycle, and

the cooler (23, 24, 25) is connected to a piping (51) of the refrigerant circuit (50) through a non-conductive piping member (29).

7. The semiconductor device of claim 1, wherein

the semiconductor chip (21, 22) is a semiconductor device using a wide bandgap semiconductor.