Camera Module for Vehicle

• US 20140320657A1
• Filed: 06/26/2012
• Published: 10/30/2014
• Est. Priority Date: 11/08/2011
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Han, Sangyeal, Cho, Bumsig, Kim, Daeseung, Lee, Seungho
• Granted Patent: US 10,057,467 B2
• Time in Patent Office: Days
• US Class Current: 348/148
• CPC Class Codes: B60R 11/04 Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A camera module for a vehicle according to the present invention includes a first Printed Circuit Board (PCB) configured to have an image sensor mounted on its surface; a second PCB configured to supply a power source to the first PCB; an outer shield installed to surround the side of the first and the second PCBs and to shield the first and the second PCBs from electromagnetic interference (EMI); and a plurality of support units disposed at positions where the supports units interfere with the first and the second PCBs of the outer shield and configured to support the first and the second PCBs.

Claims

1. A camera module for a vehicle, comprising:

a first Printed Circuit Board (PCB) configured to have an image sensor mounted on its surface;

a second PCB configured to supply a power source to the first PCB;

an outer shield installed to surround a side of the first and the second PCBs and to shield the first and the second PCBs from electromagnetic interference (EMI); and

a plurality of support units disposed at positions where the supports units interfere with the first and the second PCBs of the outer shield and configured to support the first and the second PCBs.

2. The camera module of claim 1, wherein each of the support units comprises:

a through hole formed to penetrate the outer shield, formed in a surface of a wall of the outer shield, and configured to accommodate a support protrusion protruded from the side of the first and the second PCBs; and

a tension spring formed by partially bending a sidewall face of the outer shield and configured to support a face where the tension spring faces the support protrusion of the through hole.

3. The camera module of claim 2, wherein each of pairs of the support units are symmetrically disposed on the sidewall face of the outer shield up and down and are configured to support the first and the second PCBs simultaneously.

4. The camera module of claim 2, wherein the support protrusion includes a ground terminal unit plated with conductive material and formed at a position where the support protrusion interferes with the tension spring.

5. The camera module of claim 1, wherein the outer shield is integrally formed with conductive material.

6. The camera module of claim 1, further comprising:

a lens module disposed over the first PCB and configured to transfer an image to the image sensor; and

a cover member configured to cover a top of the lens module and the first PCB.

7. The camera module of claim 1, wherein the support units support at least three faces of the first and the second PCBs.

8. The camera module of claim 1, wherein the support units space the first and the second PCBs from each other at a specific interval.

9. A camera module for a vehicle, comprising:

a first Printed Circuit Board (PCB) configured to have an image sensor mounted on its surface;

a second PCB configured to supply a power source to the first PCB;

an outer shield installed to surround a side of the first and the second PCBs and made of conductive metal material that shields the first and the second PCBs from electromagnetic interference (EMI); and

a plurality of support units forming by partially bending the outer shield, disposed at positions where the supports units interfere with the first and the second PCBs, and configured to support the first and the second PCBs.

10. The camera module of claim 9, wherein each of the support units comprises:

a through hole formed to penetrate the outer shield, formed in a surface of a wall of the outer shield, and configured to accommodate a support protrusion protruded from the side of the first and the second PCBs; and

a tension spring formed by partially bending a sidewall face of the outer shield and configured to support a face where the tension spring faces the support protrusion of the through hole.

11. The camera module of claim 10, wherein each of pairs of the support units are symmetrically disposed on the sidewall face of the outer shield up and down and are configured to support the first and the second PCBs simultaneously.

12. The camera module of claim 10, wherein the support protrusion includes a ground terminal unit plated with conductive material and formed at a position where the support protrusion interferes with the tension spring.

13. The camera module of claim 9, further comprising:

a lens module disposed over the first PCB and configured to transfer an image to the image sensor; and

a cover member configured to cover a top of the lens module and the first PCB.

14. The camera module of claim 9, wherein the support units support at least three faces of the first and the second PCBs.

15. The camera module of claim 9, wherein the support units space the first and the second PCBs from each other at a specific interval.