APPARATUS AND METHOD FOR DISSIPATING HEAT
First Claim
Patent Images
1. An apparatus comprising:
- a display including a frame disposed at a bottom surface of the display;
a semiconductor chip; and
a first heat pipe affixed to the frame, the first heat pipe being comprised of a thermally conductive material, whereina surface of the first heat pipe opposes the semiconductor chip at a predetermined distance from the semiconductor chip.
1 Assignment
0 Petitions
Accused Products
Abstract
An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.
-
Citations
21 Claims
-
1. An apparatus comprising:
-
a display including a frame disposed at a bottom surface of the display; a semiconductor chip; and a first heat pipe affixed to the frame, the first heat pipe being comprised of a thermally conductive material, wherein a surface of the first heat pipe opposes the semiconductor chip at a predetermined distance from the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
-
-
20. A method of dissipating heat from a semiconductor chip in a mobile device, the method comprising:
-
affixing a heat pipe to a frame disposed at a bottom surface of a display included on the mobile device; and dissipating heat generated by the semiconductor chip by arranging the heat pipe such that a surface of the heat pipe opposes the semiconductor chip at a predetermined distance from the semiconductor chip, wherein the heat pipe is comprised of a thermally conductive material.
-
-
21. An apparatus comprising:
-
a display including a frame disposed at a bottom surface of the display; a semiconductor chip; and a heat dissipation means for dissipating heat from the semiconductor chip, wherein the heat dissipation means is affixed to the frame, the heat dissipation means is comprised of a thermally conductive material, and a surface of the heat dissipation means opposes the semiconductor chip at a predetermined distance from the semiconductor chip.
-
Specification