HOLD DOWN FOR RETAINING A HEAT SINK
First Claim
1. A hold down for an electronic device that includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad, wherein the hold down comprises:
- a generally planar portion adapted to be positioned over a surface of the heat sink; and
a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply a biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame.
3 Assignments
0 Petitions
Accused Products
Abstract
At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.
113 Citations
20 Claims
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1. A hold down for an electronic device that includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad, wherein the hold down comprises:
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a generally planar portion adapted to be positioned over a surface of the heat sink; and a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply a biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An electronic device comprising:
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a support frame; a circuit board coupled to the support frame and having at least one component; a thermal pad thermally coupled to the component; a heat sink associated with the thermal pad; and a hold down for providing a biasing force against the heat sink, wherein the hold down comprises; a generally planar portion adapted to be positioned over a surface of the heat sink; and a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold down to apply the biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method comprising:
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accessing a hold down for an electronic device, the electronic device including a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad, wherein the hold down includes; a generally planar portion adapted to be positioned over a surface of the heat sink; and a plurality of connecting structures extending angularly from the generally planar portion and configured to engage the support frame to cause the hold to apply the biasing force against the heat sink to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame; and attaching a first of the connecting structures to a first mating location defined on the support frame; and attaching a second of the connecting structures to a second mating location defined on the support frame, wherein the generally planar portion is configured to engage with the first and second mating locations to cause the hold down to apply the biasing force.
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19. The method of claim 19, wherein:
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the connecting structures comprise an aperture configured to engage with one or more extensions protruding from the support frame, attaching the first of the connecting structures comprises placing the aperture of the first connecting structure over one or more extensions of the support frame, and attaching the second of the connecting structures comprises placing the aperture of the second connecting structure over one or more additional extensions of the support frame. - View Dependent Claims (20)
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Specification