MEMS Microphone With Out-Gassing Openings And Method Of Manufacturing The Same

• US 20140321687A1
• Filed: 04/14/2014
• Published: 10/30/2014
• Est. Priority Date: 04/24/2013
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Friel, Kurt B., Szczech, John B.
• Granted Patent: US 9,301,075 B2
• Time in Patent Office: Days
• US Class Current: 381/361
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

An acoustic apparatus includes a substrate, micro electro mechanical system (MEMS) die, and an integrated circuit. The substrate includes a permanent opening that extends there through. The micro electro mechanical system (MEMS) die is disposed over the permanent opening and the MEMS die includes a pierce-less diaphragm that is moved by sound energy. A first temporary opening extends through the substrate. The integrated circuit is disposed on the substrate and includes a second opening. The first temporary opening and the second opening are generally aligned. A cover that is coupled to the substrate and encloses the MEMS die and the integrated circuit. The cover and the substrate form a back volume, and the diaphragm separates the back volume from a front volume. The first temporary opening is unrestricted at a first point in time to allow gasses present in the back volume to exit through the temporary opening to the exterior and the pierce-less diaphragm prevents the gasses from passing there through. The first temporary opening is later substantially filled and closed at a second point in time, after which the acoustic device becomes operational.

Claims

1. An acoustic apparatus, the apparatus comprising:

a substrate including a permanent opening extending there through;

a micro electro mechanical system (MEMS) die disposed over the permanent opening, the MEMS die including a pierce-less diaphragm that is moved by sound energy;

an integrated circuit being disposed on the substrate and being electrically coupled to the MEMS die;

a first temporary opening that extends through the substrate and a second opening extending through the integrated circuit, the first temporary opening being generally aligned with the second opening;

a cover that is coupled to the substrate and that encloses the MEMS die and the integrated circuit, such that the cover and the substrate form a back volume, and such that the diaphragm separates the back volume from a front volume;

such that the first temporary opening and the second opening are unrestricted at a first point in time to allow gasses present in the back volume to exit through the first temporary opening and the second opening to the exterior, the pierce-less diaphragm preventing the gasses from passing there through; and

such the first temporary opening is later substantially filled and closed at a second point in time, after which the acoustic device becomes operational.

2. The acoustic apparatus of claim 1, wherein the first temporary opening is larger than the second opening.

3. The acoustic apparatus of claim 2, wherein the second opening is at least partially filled after the second point in time.

4. The acoustic apparatus of claim 1, wherein the first temporary opening is closed with an epoxy.

5. A method of manufacturing an acoustic device, the method comprising:

providing an acoustic apparatus, the apparatus comprising;

a substrate including a permanent opening,

a micro electro mechanical system (MEMS) die disposed over the permanent opening, the MEMS die including a pierce-less diaphragm that is moved by sound energy;

an integrated circuit disposed on the substrate and being electrically coupled to the MEMS die;

creating a first temporary opening that extends through the substrate and wherein a second opening extends through the integrated circuit, the first temporary opening being generally aligned with the second opening;

placing a cover that over the substrate to enclose the MEMS die and the integrated circuit, such that the cover and the substrate form a back volume, and such that the diaphragm separates the back volume from a front volume;

at a first point in time, allowing unrestricted passage of gasses present in the back volume through the first temporary opening and the second opening to the exterior, the gasses not passing through the diaphragm; and

subsequently and at a second point in time, substantially filling and closing the first temporary opening.

6. The method of claim 5 further comprising operating the acoustic device.

7. The method of claim 5, wherein the first temporary opening is larger than the second opening.

8. The method of claim 7, wherein the second opening is at least partially filled after the second point in time.

9. The method of claim 5, wherein the first temporary opening is closed with an epoxy.